Ultra-high heat-resistant bismaleimide resin HR series HR-YSP
Printec Co., Ltd.

About This Product

Our original bismaleimide resin provides high reliability due to its extremely high heat resistance. In addition, bismaleimide is generally difficult to dissolve in general-purpose solvents, but the HR series can dissolve over 70% solids in MEK, etc., so it can be used in a variety of applications.

HR-YSP is our original bismaleimide-based high heat resistant, low dielectric resin that has excellent heat resistance and special features such as low dielectric properties and can be dissolved in methyl ethyl ketone (MEK).

◼︎Features
・Ultra high heat resistance
It develops a Tg of 280℃ or more, contributing to improved reliability in various situations.

・Solvent solubility
It does not require environmentally hazardous solvents such as NMP or DMAc.

・Low softening temperature
Although it is a high heat resistant resin, it has a softening temperature of less than 100℃, making it easy to work with.

◼︎Applications
Semiconductor package substrates, power semiconductor EMC, heat-resistant paints, high-speed communication substrates (5G/6G), CFRP/GFRP