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  2. Diamond whetstone UNIVA-X (Nanotem Co., Ltd.)
Diamond whetstone UNIVA-X-UNIVA-X
Diamond whetstone UNIVA-X-Nanotem Co., Ltd.

Diamond whetstone UNIVA-X
Nanotem Co., Ltd.

About This Product

■Are you wasting your whetstone when dressing?

・Ideal cutting quality and grinding wheel life due to honeycomb size/thickness ・The abrasive grains in the core part work as free abrasive grains to improve processing efficiency. ・Maximize non-dress and dress intervals ・Distributed load can be controlled by diamond patterning Achieving high efficiency machining and reducing total costs

■High-efficiency grinding of cutting-edge electronic component materials Special diamond grinding wheel development

The characteristic is that the diamond part has a higher degree of bonding than the core part. If the workpiece is pressed against the workpiece, the core will wear out faster. The diamond part becomes higher by approximately 10 microns (depending on the diamond particle size), and the workpiece is always in contact with the diamond. Patterning such as the size of the core part and the width of the diamond part can be designed arbitrarily according to the material of the workpiece, and the shared load of the diamond on the workpiece can be increased, maximizing the power of the grinding wheel. It is possible to pull it out.

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    Diamond whetstone UNIVA-X

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1 Models of Diamond whetstone UNIVA-X

Image Part Number Price (excluding tax)
Diamond whetstone UNIVA-X-Part Number-UNIVA-X

UNIVA-X

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About Company Handling This Product

Nanotem Co., Ltd.

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