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Carrier substrate receiving and cleaning equipment-PWG-2501
Carrier substrate receiving and cleaning equipment-PHT Co., Ltd.

Carrier substrate receiving and cleaning equipment
PHT Co., Ltd.


About This Product

■Product features

Cutting-edge chiplet packaging technology is being developed for next-generation semiconductors, and glass substrates are expected to be used as carrier substrates for packages. We can propose transportation and cleaning equipment for glass carrier substrates.

■Introduction example

This device is used for receiving and cleaning glass substrates. No chemicals are used, only pure water (DIW) is used. Cleaning process and equipment configuration. The process is in the following order: (1) Input conveyor → (2) Idle → (3) Two-fluid shower cleaning → (4) Brush cleaning → (5) Pure water shower cleaning → (6) Final rinse with pure water → (7) Draining with water absorption roller → (8) Slit nozzle drying using air knife (9) Ionizer blow drying with LD & ULD. (Includes load port)

  • Product

    Carrier substrate receiving and cleaning equipment

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1 Models of Carrier substrate receiving and cleaning equipment

Image Part Number Price (excluding tax)
Carrier substrate receiving and cleaning equipment-Part Number-PWG-2501

PWG-2501

Available upon quote

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