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  2. Clamshell type crystal device socket (CXP series) CXP-S02-08-00 (MiS Technologies Corporation)

Clamshell type crystal device socket (CXP series) CXP-S02-08-00
MiS Technologies Corporation

About This Product

■ Global share of crystal device sockets: over 70%

Our main products are not sockets for semiconductor devices, but sockets for crystal devices, and we now offer a rich lineup of over 1,700 types that are compatible with the terminal arrangements of almost all packages. We are particularly skilled in developing ultra-small SMD type (surface mount type) sockets. We hold a global share of over 70% of crystal device sockets, making us the leader in this field. MiS's four technologies solve this problem

■01 Back contact terminal structure

- Open top structure allows automatic insertion and removal by machine - By changing the package insertion direction from front mounting to back mounting, the cost of the socket is reduced

■02 Side contact terminal structure

- Open top structure allows automatic insertion and removal by machine - Structure that allows contact with the side terminal of the package

■03 Self-alignment function

- Open top structure allows automatic insertion and removal by machine - No matter where the package is placed in the socket, it is centered before contact, so the terminals will definitely touch the pads

■04 For high current devices

- Butterfly structure that makes it easy for the package to dissipate heat - Contacts are stacked so as not to affect the package, and the cross-sectional area of ​​the contact part is increased to allow the flow of large currents The CXP series has a clamshell type with a lid structure and uses probe pin contacts. Since it is manually inserted and removed, it is suitable for evaluation and testing.

  • Product

    Clamshell type crystal device socket (CXP series) CXP-S02-08-00

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1 Models of Clamshell type crystal device socket (CXP series) CXP-S02-08-00

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CXP-S02-08-00

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MiS Technologies Corporation

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