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Ligid Flexible Print Wiring Plate Design, manufacturing and implementation of thin rigid FPC [new method]-Thin rigid FPC
Ligid Flexible Print Wiring Plate Design, manufacturing and implementation of thin rigid FPC [new method]-Shinwa Print Industry Co., Ltd.

Ligid Flexible Print Wiring Plate Design, manufacturing and implementation of thin rigid FPC [new method]
Shinwa Print Industry Co., Ltd.


About This Product

Design of Rigid Flexible substrate-manufacturing -Compasses implementation at domestic factories. Leave the Rigid Flexible substrate, such as small amounts, short delivery, prototypes, mass production, etc.

■ Features

・ It is a print board that combines a rigid board and FPC. ・ Because the rigid part has a multilayer structure, it can be implemented high density. ・ Unlike the connection with the connector, you can ensure high reliability by direct connection in the conductor layer. ・ In the case of 0.3mm thick, it can be inserted directly into the connector. ・ Compatible with small lots/multiple types. We also accept prototypes and mass production from one repeat. ・ The processing of manufacturing small lots is highly efficient, reducing costs. ・ We achieve high reliability with more than 20 years of manufacturing know -how. ・ Since the work is performed on the implementation line in the company factory, short delivery time is possible. ・ It is also possible to use our stock parts. ・ We will answer various requests. Please contact us for details.

■ Manufacturing process

・ Professional of implementation technology provides the best pattern design for requirement specifications. Please leave both flexible design and rigid board design. ・ Verify all design data before manufacturing. Prevents troubles caused by design data and realizes reliable products. ・ Speed ​​production on the production line in our own factory. We produce all of the flexes (FPC), rigid boards, and rigid flexible in -house.

  • Product

    Ligid Flexible Print Wiring Plate Design, manufacturing and implementation of thin rigid FPC [new method]

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1 Models of Ligid Flexible Print Wiring Plate Design, manufacturing and implementation of thin rigid FPC [new method]

Image Part Number Price (excluding tax) Number of layers Base material Thickness Cover ray surface treatment Environmental support
Ligid Flexible Print Wiring Plate Design, manufacturing and implementation of thin rigid FPC [new method]-Part Number-Thin rigid FPC

Thin rigid FPC

Available upon quote

Rigid part: 3-6 layers, FPC portion: 2 layers

Polyimid film + glass epoxy

0.3 ~ 0.6mm

Polyimid film, and sorder register ink

Gold plating processing, tin plating processing, heat -resistant preprux processing

ROHS command, lead -free, halogen -free support

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