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Next -generation thin film insulating material OS that realizes a low heat conductivity of the air
Hirose Paper Co., Ltd.


About This Product

The OS is a next -generation thin film insulation material that has a special silica with synthetic fibers and achieves a low heat conductivity as air. The thermal conductivity is as low as 0.023W/m/K, and the thickness can be used from 0.1 to 1 mm. There are various uses, such as use in places where there is no clearance and cannot be used with conventional insulation materials, used as auxiliary materials for existing insulation materials, and combined with other materials such as heat discharge.

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    Next -generation thin film insulating material OS that realizes a low heat conductivity of the air

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