Solution to fill the gap Thermal phase change material WE-PCM
Würth Elektronik
About This Product
■Features
・Size and shape can be customized
・Alternatives to thermal paste and grease
・Electrical insulation as required
- Lower thermal resistance than other TIM solutions
・Easy to handle in manufacturing environment
■Application
·power supply
・Transistor: FET, IGBT
・SiC and GaN
・High-speed system: FPGA, CPU, GPU
・IC: ADC, DAC, memory module
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Product
Solution to fill the gap Thermal phase change material WE-PCM
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Handling Company
Würth Elektronik
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Categories
1 Models of Solution to fill the gap Thermal phase change material WE-PCM
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
|
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WE-PCM |
Available upon quote |
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