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Signal and Communication Multilayer Chip Balun WE-BAL-WE-BAL
Signal and Communication Multilayer Chip Balun WE-BAL-Würth Elektronik

Signal and Communication Multilayer Chip Balun WE-BAL
Würth Elektronik


About This Product

■Features

Low loss SMT balun with balanced impedance 50~200Ω

■Application

・RF applications ・Home Wireless communication systems such as RF, DECT, WLAN, Bluetooth, ZigBee...

  • Product

    Signal and Communication Multilayer Chip Balun WE-BAL

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1 Models of Signal and Communication Multilayer Chip Balun WE-BAL

Image Part Number Price (excluding tax) Height (mm) Power capacity Length (mm) Width (mm) Operating temperature Mount Size
Signal and Communication Multilayer Chip Balun WE-BAL-Part Number-WE-BAL

WE-BAL

Available upon quote

0.6~0.85

Max 2W

1.6~2

0.8~1.25

–40℃ ~ +85℃

Sumatra

0603/0805

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About Company Handling This Product

Company Overview

Wera is a manufacturer of screw-driving tools with varied applications headquartered in Wuppertal, Germany, an...

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