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PCB manufacturing related equipment Through glass via hole inspection machine PAVIS-TGV-PAVIS-TGV
PCB manufacturing related equipment Through glass via hole inspection machine PAVIS-TGV-Adtech Engineering Co., Ltd.

PCB manufacturing related equipment Through glass via hole inspection machine PAVIS-TGV
Adtech Engineering Co., Ltd.


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■Features

Glass substrates can produce smoother substrate surfaces than conventional organic materials, and are attracting attention as a next-generation semiconductor package substrate material. Equipped with a dedicated table for glass materials, the size of the top, waist, and bottom can be measured at the same time without the need to flip the glass material. It allows you to check images for inspecting for foreign objects in the hole, checking for cracks and scratches, and also measures each location.

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    PCB manufacturing related equipment Through glass via hole inspection machine PAVIS-TGV

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1 Models of PCB manufacturing related equipment Through glass via hole inspection machine PAVIS-TGV

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PCB manufacturing related equipment Through glass via hole inspection machine PAVIS-TGV-Part Number-PAVIS-TGV

PAVIS-TGV

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