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  4. Simple bonding device (Japan Engis Co., Ltd.)
Simple bonding device-HWB-36
Simple bonding device-Japan Engis Co., Ltd.

Simple bonding device
Japan Engis Co., Ltd.

About This Product

The bonding equipment HWB series is a simple bonding equipment used in a wide range of fields. The cooling table is equipped with a water jacket, and by connecting a cooling type circulation chiller, the pasting board can be efficiently cooled. Adhesive pressure is achieved by pressing an aligned plane plate with a pressurized cylinder to suppress uneven wax application and achieve good adhesion. Option 1-Hot Plate-EC-1200NP

■Plate size

400mm x 300mm

■Maximum temperature

300℃

■Power supply

AC100V 900W Option 2-Chiller-HRS-050-A-20-B

■Temperature adjustment range

5～40℃　±0.1℃

■Maximum flow rate

50Hz 29 L/min 60Hz 38 L/min

■Power supply

AC200V 550W

  • Product

    Simple bonding device

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1 Models of Simple bonding device

Image Part Number Price (excluding tax) Number of axes Compatible pasting board size
Simple bonding device-Part Number-HWB-36

HWB-36

Available upon quote

Single type

⌀383mm

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About Company Handling This Product

Japan Engis Co., Ltd.

  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Japan Engis Co., Ltd.
Japan Engis Co., Ltd.

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