Simple bonding device
Japan Engis Co., Ltd.
About This Product
The bonding equipment HWB series is a simple bonding equipment used in a wide range of fields.
The cooling table is equipped with a water jacket, and by connecting a cooling type circulation chiller, the pasting board can be efficiently cooled. Adhesive pressure is achieved by pressing an aligned plane plate with a pressurized cylinder to suppress uneven wax application and achieve good adhesion.
Option 1-Hot Plate-EC-1200NP
■Plate size
400mm x 300mm
■Maximum temperature
300℃
■Power supply
AC100V 900W
Option 2-Chiller-HRS-050-A-20-B
■Temperature adjustment range
5～40℃ ±0.1℃
■Maximum flow rate
50Hz 29 L/min 60Hz 38 L/min
■Power supply
AC200V 550W
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Product
Simple bonding device
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Handling Company
Japan Engis Co., Ltd.
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Categories
1 Models of Simple bonding device
| Product Image | Part Number | Price (excluding tax) | Compatible pasting board size | Number of axes |
|---|---|---|---|---|
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|
HWB-36 |
Available upon quote | ⌀383mm | Single type |
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About Company Handling This Product
- Japan