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  4. Wafer bonding equipment EBM-200HCD (Japan Engis Co., Ltd.)
Wafer bonding equipment EBM-200HCD-EBM-200HCD
Wafer bonding equipment EBM-200HCD-Japan Engis Co., Ltd.

Wafer bonding equipment EBM-200HCD
Japan Engis Co., Ltd.

About This Product

EBM-250HCD is a device designed and developed for bonding wafers and bonding plates (ceramic plates). Solid wax is liquefied and a dispenser supplies a certain amount of wax according to the wafer size. In addition, by applying pressure, heating, and cooling on the same table, it is possible to control wafer thickness variations and flatness/parallelism due to bonding.

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    Wafer bonding equipment EBM-200HCD

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1 Models of Wafer bonding equipment EBM-200HCD

Image Part Number Price (excluding tax) Power supply Weight (Kg NET) Pneumatic equipment Operation status notification Body dimensions (WxDxHmm) Heating method Cooling method Wax dispenser Pressure plate material Shutter opening/closing Wafer size Wafer placement
Wafer bonding equipment EBM-200HCD-Part Number-EBM-200HCD

EBM-200HCD

Available upon quote

3 phase AC200V 50/60Hz

400

Air cylinder ⌀100 / Stroke: 250mmL

3 color signal tower with buzzer

780x750x1,870

Electric heating Max.150℃

Cooling water circulation with external chiller (timer control)

Electric heating tank Max.150℃

SUS (⌀250mm)

Air cylinder/select switch

Max.⌀248mm

Manual

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About Company Handling This Product

Japan Engis Co., Ltd.

  • Japan

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Semiconductor Manufacturing Equipment Component & Part Machining
Semiconductor Manufacturing Equipment Component & Part Machining　Japan Engis Co., Ltd.
Japan Engis Co., Ltd.

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