Wafer bonding equipment EBM-200HCD
Japan Engis Co., Ltd.
About This Product
EBM-250HCD is a device designed and developed for bonding wafers and bonding plates (ceramic plates). Solid wax is liquefied and a dispenser supplies a certain amount of wax according to the wafer size. In addition, by applying pressure, heating, and cooling on the same table, it is possible to control wafer thickness variations and flatness/parallelism due to bonding.
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Product
Wafer bonding equipment EBM-200HCD
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Handling Company
Japan Engis Co., Ltd.
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Categories
1 Models of Wafer bonding equipment EBM-200HCD
| Product Image | Part Number | Price (excluding tax) | Body dimensions (WxDxHmm) | Cooling method | Heating method | Operation status notification | Pneumatic equipment | Power supply | Pressure plate material | Shutter opening/closing | Wafer placement | Wafer size | Wax dispenser | Weight (Kg NET) |
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EBM-200HCD |
Available upon quote | 780x750x1,870 | Cooling water circulation with external chiller (timer control) | Electric heating Max.150℃ | 3 color signal tower with buzzer | Air cylinder ⌀100 / Stroke: 250mmL | 3 phase AC200V 50/60Hz | SUS (⌀250mm) | Air cylinder/select switch | Manual | Max.⌀248mm | Electric heating tank Max.150℃ | 400 |
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About Company Handling This Product
- Japan