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Large polishing equipment-EJD-910I-ALD
Large polishing equipment-Japan Engis Co., Ltd.

Large polishing equipment
Japan Engis Co., Ltd.


About This Product

In particular, we have a complete lineup of high-precision large lapping equipment of various sizes to meet the high-quality polishing required as semiconductor wafers become larger in diameter. The fully covered machining chamber has excellent safety, prevents dust from entering the room, and provides high-quality surface roughness.

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    Large polishing equipment

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1 Models of Large polishing equipment

Image Part Number Price (excluding tax) Power supply Weight (Kg NET) Pasting board size (mm) Water cooling mechanism Standard number of axes Standard surface plate size (⌀Outer diameter x ⌀Inner diameter mm) Body dimensions (WxDxHmm) Spindle motor (kW) Ring size (⌀Outer diameter x ⌀Inner diameter mm)
Large polishing equipment-Part Number-EJD-910I-ALD

EJD-910I-ALD

Available upon quote

3 phase AC200V 50/60Hz

3,000

383

3 station roller arm

910x300

2,000x1,600x2,000

7.5

435x385

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