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  4. Small polishing device (Japan Engis Co., Ltd.)
Small polishing device-EJW-460-CMP
Small polishing device-Japan Engis Co., Ltd.

Small polishing device
Japan Engis Co., Ltd.

About This Product

Tabletop and stationary lapping machines are designed to be the perfect size for creating highly flexible polishing processes from lab scale to production scale. The use of a highly rigid body especially suitable for high-pressure polishing and a uniquely developed water-cooled spindle keeps the pad surface temperature constant at all times and provides high rotation accuracy with little vibration.

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    Small polishing device

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1 Models of Small polishing device

Image Part Number Price (excluding tax) Power supply Weight (Kg NET) Pasting board size (mm) Water cooling mechanism Standard number of axes / Pressurized cylinder mechanism installed Standard surface plate size (⌀Outer diameter x ⌀Inner diameter mm) Body dimensions (WxDxHmm) Spindle motor (kW) Ring size (⌀Outer diameter x ⌀Inner diameter mm)
Small polishing device-Part Number-EJW-460-CMP

EJW-460-CMP

Available upon quote

3 phase AC200V 50/60Hz

1,000

180

○

Swing forced drive drive x 2 axes

460×180

1,200x1,300x1,900

2.2

220×182

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About Company Handling This Product

Japan Engis Co., Ltd.

  • Japan

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