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  4. NIC BOND Low temperature fast curing 1-component adhesive TNB6322HF (Daizo Co., Ltd.)
NIC BOND Low temperature fast curing 1-component adhesive TNB6322HF-TNB6322HF
NIC BOND Low temperature fast curing 1-component adhesive TNB6322HF-Daizo Co., Ltd.

NIC BOND Low temperature fast curing 1-component adhesive TNB6322HF
Daizo Co., Ltd.

Daizo Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

24.0hours

Relatively Fast Response

About This Product

■Product overview

TNB6322HF is a newly developed one-component epoxy adhesive that cures quickly at low temperatures. It has excellent adhesion to metal substrates. This product is also RoHS and halogen compliant.

■Product features and applications

・High adhesive strength ・Short-time curing possible (120℃/5 minutes) ・Compatible with halogen and RoHS standards ・Silica filler type ・Low temperature fast curing

■Properties before curing

・Liquid: 1 liquid ・Curing conditions: 100℃/15 minutes ・Viscosity: 40,000cP ・Pot life (23℃): 1 month or more ・Storage conditions: 5℃ ・Quality guarantee period: 3 months

■Properties after curing

・Tensile shear strength: 200kgf/cm2 ・Glass transition temperature (Tg): 100℃ or more ・Linear expansion coefficient: 68ppm below Tg, 168ppm above Tg ・Shore D hardness: 86

  • Product

    NIC BOND Low temperature fast curing 1-component adhesive TNB6322HF

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1 Models of NIC BOND Low temperature fast curing 1-component adhesive TNB6322HF

Image Part Number Price (excluding tax) Shelf stability period Product packaging
NIC BOND Low temperature fast curing 1-component adhesive TNB6322HF-Part Number-TNB6322HF

TNB6322HF

Available upon quote

-40℃/12 months

500cc bottle

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About Company Handling This Product

Daizo Co., Ltd.

Response Rate

100.0%

Response Time

24.0hrs

  • Japan

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