NIC BOND Low temperature fast curing 1-component adhesive TNB6322HF
Daizo Co., Ltd.
About This Product
■Product overview
TNB6322HF is a newly developed one-component epoxy adhesive that cures quickly at low temperatures. It has excellent adhesion to metal substrates. This product is also RoHS and halogen compliant.
■Product features and applications
・High adhesive strength
・Short-time curing possible (120℃/5 minutes)
・Compatible with halogen and RoHS standards
・Silica filler type
・Low temperature fast curing
■Properties before curing
・Liquid: 1 liquid
・Curing conditions: 100℃/15 minutes
・Viscosity: 40,000cP
・Pot life (23℃): 1 month or more
・Storage conditions: 5℃
・Quality guarantee period: 3 months
■Properties after curing
・Tensile shear strength: 200kgf/cm2
・Glass transition temperature (Tg): 100℃ or more
・Linear expansion coefficient: 68ppm below Tg, 168ppm above Tg
・Shore D hardness: 86
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Product
NIC BOND Low temperature fast curing 1-component adhesive TNB6322HF
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Handling Company
Daizo Co., Ltd.
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Categories
1 Models of NIC BOND Low temperature fast curing 1-component adhesive TNB6322HF
| Product Image | Part Number | Price (excluding tax) | Product packaging | Shelf stability period |
|---|---|---|---|---|
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TNB6322HF |
Available upon quote | 500cc bottle | -40℃/12 months |
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About Company Handling This Product
- Japan