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NIC BOND Low temperature curing 2-component insulation/heat dissipating adhesive NB5000-NB5000
NIC BOND Low temperature curing 2-component insulation/heat dissipating adhesive NB5000-Daizo Co., Ltd.

NIC BOND Low temperature curing 2-component insulation/heat dissipating adhesive NB5000
Daizo Co., Ltd.


About This Product

■Product overview

NB5000 is a two-component insulating/heat dissipating adhesive that can be cured at room temperature. It hardens at low temperatures and is characterized by high thermal conductivity. In addition, the appearance after curing is white, making it easy to confirm the application.

■Product features and applications

・Can be cured at room temperature ・High thermal conductivity ・Appearance is white after curing, making it easy to confirm application ・Bonding of ceramic and metal, adhesion of metal and heat sink ・Heat radiation of X-ray/ultrasonic equipment

■Properties before curing

・Liquid: 2 liquid ・Mixing ratio (weight ratio): 100:25 ・Curing conditions: 80℃/1 hour ・Viscosity (after mixing): 15,000-25,000cP ・Pot life (23℃): 1 hour ・Storage conditions: room temperature ・Quality guarantee period: 1 year

■Properties after curing

・Tensile shear strength: 110kgf/cm2 ・Glass transition temperature (Tg): 80℃ or higher ・Linear expansion coefficient: 18ppm below Tg, 89ppm above Tg ・Shore D hardness: 85 ・Volume resistivity: 2×10^13Ω・cm or more ・Thermal conductivity: 3.0W/mK

  • Product

    NIC BOND Low temperature curing 2-component insulation/heat dissipating adhesive NB5000

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1 Models of NIC BOND Low temperature curing 2-component insulation/heat dissipating adhesive NB5000

Image Part Number Price (excluding tax) Shelf stability period Product packaging
NIC BOND Low temperature curing 2-component insulation/heat dissipating adhesive NB5000-Part Number-NB5000

NB5000

Available upon quote

Room temperature/12 months

500cc bottle set

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