NIC BOND Low temperature curing 2-component insulation/heat dissipating adhesive NB5000
Daizo Co., Ltd.
About This Product
■Product overview
NB5000 is a two-component insulating/heat dissipating adhesive that can be cured at room temperature. It hardens at low temperatures and is characterized by high thermal conductivity. In addition, the appearance after curing is white, making it easy to confirm the application.
■Product features and applications
・Can be cured at room temperature
・High thermal conductivity
・Appearance is white after curing, making it easy to confirm application
・Bonding of ceramic and metal, adhesion of metal and heat sink
・Heat radiation of X-ray/ultrasonic equipment
■Properties before curing
・Liquid: 2 liquid
・Mixing ratio (weight ratio): 100:25
・Curing conditions: 80℃/1 hour
・Viscosity (after mixing): 15,000-25,000cP
・Pot life (23℃): 1 hour
・Storage conditions: room temperature
・Quality guarantee period: 1 year
■Properties after curing
・Tensile shear strength: 110kgf/cm2
・Glass transition temperature (Tg): 80℃ or higher
・Linear expansion coefficient: 18ppm below Tg, 89ppm above Tg
・Shore D hardness: 85
・Volume resistivity: 2×10^13Ω・cm or more
・Thermal conductivity: 3.0W/mK
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Product
NIC BOND Low temperature curing 2-component insulation/heat dissipating adhesive NB5000
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Handling Company
Daizo Co., Ltd.
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Categories
1 Models of NIC BOND Low temperature curing 2-component insulation/heat dissipating adhesive NB5000
| Product Image | Part Number | Price (excluding tax) | Product packaging | Shelf stability period |
|---|---|---|---|---|
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NB5000 |
Available upon quote | 500cc bottle set | Room temperature/12 months |
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About Company Handling This Product
- Japan