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  4. NIC BOND Low temperature curing high reliability conductive adhesive NB8101 (Daizo Co., Ltd.)
NIC BOND Low temperature curing high reliability conductive adhesive NB8101-NB8101
NIC BOND Low temperature curing high reliability conductive adhesive NB8101-Daizo Co., Ltd.

NIC BOND Low temperature curing high reliability conductive adhesive NB8101
Daizo Co., Ltd.

About This Product

■Product overview

NB8101 is a low temperature curing type of NB8100. While maintaining the high reliability and workability of NB8100, it can be cured at a lower temperature than NB8100.

■Product features and applications

・Low temperature curing product of NB8100 (120℃/15 minutes) ・Ideal for bonding solar cell modules ・Fast curing (150℃/5 minutes) ・High reliability (PCT resistance, heat shock resistance), reflow resistance ・Low outgas ・Power device die bonding

■Properties before curing

・Liquid: 1 liquid ・Curing conditions: 120℃/15 minutes ・Viscosity: 8,000-15,000cP ・Pot life: 10 days ・Storage conditions: -40℃ ・Quality guarantee period: 6 months

■Properties after curing

・Tensile shear strength: 185kgf/cm2 ・Glass transition temperature (Tg): 100℃ or more ・Linear expansion coefficient: 61ppm below Tg, 122ppm above Tg ・Volume resistivity: 5×10^-4Ω・cm or less ・Thermal conductivity: 1.7W/mK

  • Product

    NIC BOND Low temperature curing high reliability conductive adhesive NB8101

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1 Models of NIC BOND Low temperature curing high reliability conductive adhesive NB8101

Image Part Number Price (excluding tax) Shelf stability period Product packaging
NIC BOND Low temperature curing high reliability conductive adhesive NB8101-Part Number-NB8101

NB8101

Available upon quote

・5℃/1 month
・-40℃/6 months

500cc bottle

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About Company Handling This Product

Daizo Co., Ltd.

  • Japan

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