NIC BOND Low temperature curing high reliability conductive adhesive NB8101
Daizo Co., Ltd.
About This Product
■Product overview
NB8101 is a low temperature curing type of NB8100. While maintaining the high reliability and workability of NB8100, it can be cured at a lower temperature than NB8100.
■Product features and applications
・Low temperature curing product of NB8100 (120℃/15 minutes)
・Ideal for bonding solar cell modules
・Fast curing (150℃/5 minutes)
・High reliability (PCT resistance, heat shock resistance), reflow resistance
・Low outgas
・Power device die bonding
■Properties before curing
・Liquid: 1 liquid
・Curing conditions: 120℃/15 minutes
・Viscosity: 8,000-15,000cP
・Pot life: 10 days
・Storage conditions: -40℃
・Quality guarantee period: 6 months
■Properties after curing
・Tensile shear strength: 185kgf/cm2
・Glass transition temperature (Tg): 100℃ or more
・Linear expansion coefficient: 61ppm below Tg, 122ppm above Tg
・Volume resistivity: 5×10^-4Ω・cm or less
・Thermal conductivity: 1.7W/mK
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Product
NIC BOND Low temperature curing high reliability conductive adhesive NB8101
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Handling Company
Daizo Co., Ltd.
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Categories
1 Models of NIC BOND Low temperature curing high reliability conductive adhesive NB8101
| Product Image | Part Number | Price (excluding tax) | Product packaging | Shelf stability period |
|---|---|---|---|---|
|
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NB8101 |
Available upon quote | 500cc bottle |
・5℃/1 month ・-40℃/6 months |
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About Company Handling This Product
- Japan