NIC BOND Reflow resistant, high reliability 1-component conductive adhesive NB8100
Daizo Co., Ltd.
About This Product
■Product overview
NB8100 is a one-component conductive adhesive that is a lower viscosity version of NB8000 with improved dispensing performance. An adhesive with high heat resistance and excellent reliability. Additionally, this product is designed to have extremely low void generation due to its solvent-free specifications.
■Product features and applications
・Low viscosity and improved workability of NB8000
・High reliability (PCT resistance), reflow resistance
・Low outgas
・Power device die bonding
■Properties before curing
・Liquid: 1 liquid
・Curing conditions: 180℃/1 hour
・Viscosity: 8,000-15,000cP
・Pot life: 10 days
・Storage conditions: -40℃
・Quality guarantee period: 6 months
■Properties after curing
・Tensile shear strength: 202kgf/cm2
・Glass transition temperature (Tg): 100℃ or more
・Linear expansion coefficient: 52ppm below Tg, 186ppm above Tg
・Volume resistivity: 5×10^-4Ω・cm or less
・Thermal conductivity: 1.7W/mK
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Product
NIC BOND Reflow resistant, high reliability 1-component conductive adhesive NB8100
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Handling Company
Daizo Co., Ltd.
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Categories
1 Models of NIC BOND Reflow resistant, high reliability 1-component conductive adhesive NB8100
| Product Image | Part Number | Price (excluding tax) | Product packaging | Shelf stability period |
|---|---|---|---|---|
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NB8100 |
Available upon quote | 500cc bottle |
・5℃/1 month ・-40℃/6 months |
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About Company Handling This Product
- Japan