NIC BOND Reflow resistant, high reliability 1-component conductive adhesive NB8000
Daizo Co., Ltd.
About This Product
■Product overview
NB8000 is a one-component conductive adhesive. This adhesive has excellent heat resistance, is highly reliable, and has excellent adhesion to a variety of materials. In addition, this product is designed to have extremely low void generation due to its solvent-free specifications.
■Product features and applications
・High reliability (cleared environmental test (120℃/95%/2atm/96 hours))
・Bleedless (on gold plated board)
・Reflow resistance
・Low outgas
・Power device die bonding
■Properties before curing
・Liquid: 1 liquid
・Curing conditions: 180℃/1 hour
・Viscosity: 20,000-28,000cP
・Pot life: 10 days
・Storage conditions: -40℃
・Quality guarantee period: 6 months
■Properties after curing
・Tensile shear strength: 192kgf/cm2
・Glass transition temperature (Tg): 100℃ or more
・Linear expansion coefficient: 54ppm below Tg, 115ppm above Tg
・Volume resistivity: 5×10^-4Ω・cm or less
・Thermal conductivity: 1.7W/mK
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Product
NIC BOND Reflow resistant, high reliability 1-component conductive adhesive NB8000
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Handling Company
Daizo Co., Ltd.
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Categories
1 Models of NIC BOND Reflow resistant, high reliability 1-component conductive adhesive NB8000
| Product Image | Part Number | Price (excluding tax) | Product packaging | Shelf stability period |
|---|---|---|---|---|
|
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NB8000 |
Available upon quote | 500cc bottle |
・5℃/1 month ・-40℃/6 months |
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About Company Handling This Product
- Japan