NIC BOND Low stress, low temperature curing two-component conductive adhesive NB7400
Daizo Co., Ltd.
About This Product
■Product overview
NB7400 is a low stress type two-component conductive adhesive. It ensures strength and flexibility and has low resistance. This adhesive is easy to work with, has excellent dispensing properties, and is less likely to cause dispensing failures due to stringiness or dripping.
■Product features and applications
・NB7100 flexibility type
・Proven track record with X-ray scintillators
・Excellent flexibility and low volume resistivity
・Large and thin chip adhesion
・Module-base connection adhesion
■Properties before curing
・Liquid: 2 liquid
・Mixing ratio (weight ratio): 1:1
・Curing conditions: 150℃/1 hour
・Viscosity (after mixing): 1,500-3,500cP
・Pot life: 12 hours
・Storage conditions: room temperature
・Quality guarantee period: 1 year
■Properties after curing
・Die shear strength: 5kg or more
・Tensile shear strength: 40kgf/cm2
・Glass transition temperature (Tg): 100℃ or more
・Linear expansion coefficient: 12ppm below Tg, 20ppm above Tg
・Volume resistivity: 3×10^-4Ω・cm
・Thermal conductivity: 4W/mK
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Product
NIC BOND Low stress, low temperature curing two-component conductive adhesive NB7400
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Handling Company
Daizo Co., Ltd.
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Categories
1 Models of NIC BOND Low stress, low temperature curing two-component conductive adhesive NB7400
| Product Image | Part Number | Price (excluding tax) | Product packaging | Shelf stability period |
|---|---|---|---|---|
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NB7400 |
Available upon quote | 500cc bottle set | Room temperature/12 months |
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About Company Handling This Product
- Japan