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NIC BOND Low stress low temperature curing 2-component conductive adhesive NB7000-NB7000
NIC BOND Low stress low temperature curing 2-component conductive adhesive NB7000-Daizo Co., Ltd.

NIC BOND Low stress low temperature curing 2-component conductive adhesive NB7000
Daizo Co., Ltd.

Daizo Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

24.0hours

Relatively Fast Response


About This Product

■Product overview

NB7000 is a stress absorbing type low temperature curing conductive adhesive. This adhesive also has the ability to provide conductivity even when cured at low temperatures.

■Product features and applications

・Can be cured at room temperature to low temperature ・Proven track record for adhering IC card chips ・Adhesion to flexible substrates for low temperature curing ・Adhesion of RF tags and EMI shields

■Properties before curing

・Liquid: 2 liquid ・Mixing ratio (weight ratio): 100:10 ・Curing conditions: 80℃/3 hours ・Viscosity (after mixing): 800-1,600cP ・Pot life: 4 hours ・Storage conditions: room temperature ・Quality guarantee period: 1 year

■Properties after curing

・Die shear strength: 10kg or more ・Tensile shear strength: 155kgf/cm2 ・Glass transition temperature (Tg): 40℃ or higher ・Linear expansion coefficient: 52ppm below Tg, 135ppm above Tg ・Volume resistivity: 7×10^-3Ω・cm or less ・Thermal conductivity: 0.9W/mK

  • Product

    NIC BOND Low stress low temperature curing 2-component conductive adhesive NB7000

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1 Models of NIC BOND Low stress low temperature curing 2-component conductive adhesive NB7000

Image Part Number Price (excluding tax) Shelf stability period Product packaging
NIC BOND Low stress low temperature curing 2-component conductive adhesive NB7000-Part Number-NB7000

NB7000

Available upon quote

Room temperature/12 months

500cc bottle set

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About Company Handling This Product

Response Rate

100.0%


Response Time

24.0hrs

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