NIC BOND Low stress low temperature curing 2-component conductive adhesive NB7000
Daizo Co., Ltd.
About This Product
■Product overview
NB7000 is a stress absorbing type low temperature curing conductive adhesive. This adhesive also has the ability to provide conductivity even when cured at low temperatures.
■Product features and applications
・Can be cured at room temperature to low temperature
・Proven track record for adhering IC card chips
・Adhesion to flexible substrates for low temperature curing
・Adhesion of RF tags and EMI shields
■Properties before curing
・Liquid: 2 liquid
・Mixing ratio (weight ratio): 100:10
・Curing conditions: 80℃/3 hours
・Viscosity (after mixing): 800-1,600cP
・Pot life: 4 hours
・Storage conditions: room temperature
・Quality guarantee period: 1 year
■Properties after curing
・Die shear strength: 10kg or more
・Tensile shear strength: 155kgf/cm2
・Glass transition temperature (Tg): 40℃ or higher
・Linear expansion coefficient: 52ppm below Tg, 135ppm above Tg
・Volume resistivity: 7×10^-3Ω・cm or less
・Thermal conductivity: 0.9W/mK
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Product
NIC BOND Low stress low temperature curing 2-component conductive adhesive NB7000
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Handling Company
Daizo Co., Ltd.
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Categories
1 Models of NIC BOND Low stress low temperature curing 2-component conductive adhesive NB7000
| Product Image | Part Number | Price (excluding tax) | Product packaging | Shelf stability period |
|---|---|---|---|---|
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NB7000 |
Available upon quote | 500cc bottle set | Room temperature/12 months |
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About Company Handling This Product
- Japan