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  4. Optical inspection equipment Optical automatic inspection equipment for semiconductor packages RSH-230 (Nidek Advanced Technology Co., Ltd.)
Optical inspection equipment Optical automatic inspection equipment for semiconductor packages RSH-230-RSH-230
Optical inspection equipment Optical automatic inspection equipment for semiconductor packages RSH-230-Nidek Advanced Technology Co., Ltd.

Optical inspection equipment Optical automatic inspection equipment for semiconductor packages RSH-230
Nidek Advanced Technology Co., Ltd.

About This Product

Next-generation IC substrate bump inspection equipment Measures board warpage at ultra-high speed. Supports simultaneous inspection of 3D bump height and appearance of next-generation IC substrate boards. ■Features ・Free high-speed, high-precision inspection ・Ultra high-speed bump height inspection ・Optimized user interface

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    Optical inspection equipment Optical automatic inspection equipment for semiconductor packages RSH-230

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1 Models of Optical inspection equipment Optical automatic inspection equipment for semiconductor packages RSH-230

Product Image Part Number Price (excluding tax)
Optical inspection equipment Optical automatic inspection equipment for semiconductor packages RSH-230-Part Number-RSH-230

RSH-230

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Nidek Advanced Technology Co., Ltd.

  • Japan

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PCB Inspection Equipment
PCB Inspection Equipment　Nidek Advanced Technology Co., Ltd.
Nidek Advanced Technology Co., Ltd.

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