Ceramic RF device (bandpass type) TSB1N18F2G45NS001T
Taiyo Yuden Energy Device Co., Ltd.
About This Product
■Features
・Small and low profile
・Low loss・High attenuation
・Stable temperature characteristics
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Product
Ceramic RF device (bandpass type) TSB1N18F2G45NS001T
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Handling Company
Taiyo Yuden Energy Device Co., Ltd.
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Categories
1 Models of Ceramic RF device (bandpass type) TSB1N18F2G45NS001T
| Product Image | Part Number | Price (excluding tax) | Applicable soldering method | Attenuation 1 (min) (f1) | Attenuation 4 (min) (f1) | Attenuation amount 2 (min) (f1) | Attenuation amount 3 (min) (f1) | Compatible with IEC62474 (Ver. D28.00) | Compliant with RoHS Directive (10 substances) | Halogen free | Input impedance / Output impedance | Insertion loss1 (max) (within f1) | Insertion loss2 (max) (within f1) | L dimension | Old part number | Operating temperature range | Passband frequency 1 (f1) | REACH compliant (240 substances) | Ripple 1 (max) (within f1) | Standard packaging | Supply system | System | T dimension | VSWR1 (max) (within f1) | W dimension |
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TSB1N18F2G45NS001T |
Available upon quote | Reflow | 25dB at 880 to 960MHz | 20dB at 7,200 to 7,500MHz | 25dB at 1,710 to 1,910MHz | 20dB at 4,800 to 5,000MHz | Yes | Yes | Yes | 50Ω/50Ω | 2.2dB at 2,400 to 2,500MHz (+25℃) | 2.5dB at 2,400 to 2,500MHz (-40 to +85℃) | 1.6 ±0.10 mm | FI168B245001-T | -40 to +85℃ | 2,400 to 2,500MHz | Yes | 1dB at 2,400 to 2,500MHz | Tapping Paper 4,000pcs | Mass production (recommended) | Bluetooth/Wi-Fi/ZigBee | Max 0.5mm | 2.1 at 2,400 to 2,500MHz | 0.8 ±0.10 mm |
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