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Ceramic RF device (bandpass type) TSB1N18F2G45NS001THandling Company
Taiyo Yuden Energy Device Co., Ltd.Categories
Image | Part Number | Price (excluding tax) | Applicable soldering method | Passband frequency 1 (f1) | Attenuation 4 (min) (f1) | Attenuation amount 3 (min) (f1) | Attenuation amount 2 (min) (f1) | Attenuation 1 (min) (f1) | Standard packaging | Old part number | Insertion loss2 (max) (within f1) | Insertion loss1 (max) (within f1) | Input impedance / Output impedance | Supply system | Operating temperature range | Ripple 1 (max) (within f1) | Halogen free | System | W dimension | VSWR1 (max) (within f1) | T dimension | Compliant with RoHS Directive (10 substances) | REACH compliant (240 substances) | L dimension | Compatible with IEC62474 (Ver. D28.00) |
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TSB1N18F2G45NS001T |
Available upon quote |
Reflow |
2,400 to 2,500MHz |
20dB at 7,200 to 7,500MHz |
20dB at 4,800 to 5,000MHz |
25dB at 1,710 to 1,910MHz |
25dB at 880 to 960MHz |
Tapping Paper 4,000pcs |
FI168B245001-T |
2.5dB at 2,400 to 2,500MHz (-40 to +85℃) |
2.2dB at 2,400 to 2,500MHz (+25℃) |
50Ω/50Ω |
Mass production (recommended) |
-40 to +85℃ |
1dB at 2,400 to 2,500MHz |
Yes |
Bluetooth/Wi-Fi/ZigBee |
0.8 ±0.10 mm |
2.1 at 2,400 to 2,500MHz |
Max 0.5mm |
Yes |
Yes |
1.6 ±0.10 mm |
Yes |
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Reviews shown here are reviews of companies.