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  2. Diamond applied products Diamond scribe tools (Techdia Co., Ltd.)
Diamond applied products Diamond scribe tools-TD-3YP
Diamond applied products Diamond scribe tools-Techdia Co., Ltd.

Diamond applied products Diamond scribe tools
Techdia Co., Ltd.

About This Product

This is a diamond scribe tool using Techdia's unique method. Scribing technology is an indispensable technology in today's semiconductor manufacturing process, as it allows for dry, clean cutting without applying water or heat to the workpiece. Taking advantage of our many years of experience in diamond processing, we have a wide range of scribing tools that are compatible with various types of wafers. Characteristics of scribe cut

■Dry cut

Since no water is used during scribing, there is no need to use water-soluble materials or static electricity. In addition, there is no adverse effect on the chip due to water.

■Improved chip integration rate

Generally, the width of the V-groove created by scribing is 2 to 5 μm, which increases the chip integration rate per wafer and allows for cost reduction.

■Crack control

Scribe cutting is the process of cutting chips into the desired shape using the internal stress generated by the scribe and the resulting cracks. In order to effectively control this cracking, it is necessary to select the optimal cutting edge shape for the wafer.

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    Diamond applied products Diamond scribe tools

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1 Models of Diamond applied products Diamond scribe tools

Image Part Number Price (excluding tax)
Diamond applied products Diamond scribe tools-Part Number-TD-3YP

TD-3YP

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Techdia Co., Ltd.

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