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Robot hand development Wafer transfer EC type-EC type FORK Thin type
Robot hand development Wafer transfer EC type-Harmotech Co., Ltd.

Robot hand development Wafer transfer EC type
Harmotech Co., Ltd.


About This Product

■Supports wafer edge exregion

With conventional wafers, it was extremely difficult to transport wafers that were severely warped or bent due to thinning or film-forming processes without contact. Therefore, by reviewing the details of KUMADE, we succeeded in developing a new non-contact transfer hand that can be used for both the front and back sides of the wafer without touching anything other than the outer periphery of the wafer.

■Applicable wafer example

・TAIKO ・MEMS ・Thin wafer

■FORK Thin type

・Can be used as an end effector for robots ・Can access wafer cassettes ・Elimination of particle transfer to wafer ・Loading access to the wafer surface is possible ・Elimination of static electricity charge and peeling charge ・Reducing equipment takt time by centering during transportation

■CIRCLE Large area holding type

・Can be used as an end effector for robots ・Can be used as a chuck stage ・Stress-free for ultra-thin wafers ・Eliminates cracks and cracks when transporting ultra-thin wafers ・Available for coin stack type transport cases ・Elimination of particle transfer to wafer ・Loading access to the wafer surface is possible ・Elimination of static electricity charge and peeling charge ・Reducing equipment takt time by centering during transportation

■HOLDER manual tweezers type

・Manual tweezers for handling ultra-thin wafers ・Stress-free for wafers ・Suitable for small to large diameters ・Supports access to wafer cassettes

  • Product

    Robot hand development Wafer transfer EC type

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1 Models of Robot hand development Wafer transfer EC type

Image Part Number Price (excluding tax)
Robot hand development Wafer transfer EC type-Part Number-EC type FORK Thin type

EC type FORK Thin type

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