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  4. Device Inkjet patterning model All-in-one inkjet coating device (high-definition model) (Ishii Notation Co., Ltd.)
Device Inkjet patterning model All-in-one inkjet coating device (high-definition model)-IP300-P
Device Inkjet patterning model All-in-one inkjet coating device (high-definition model)-Ishii Notation Co., Ltd.

Device Inkjet patterning model All-in-one inkjet coating device (high-definition model)
Ishii Notation Co., Ltd.

About This Product

■High-definition patterning/partial coating

A model that can perform everything from high-definition patterning to partial coating to drying. Particle-containing inks are also available. Recruitment example

■Aligning agent coating process

An alignment agent that is indispensable for liquid crystal panels (LCDs). Ishii's inkjet system is used in highly difficult fields where production volumes are high and quality is required to form thin films on the order of several hundred angstroms.

■Insulating film formation process

An essential insulating layer for all electronic components. Ishii's inkjet system is used to make maximum use of high-performance insulating materials.

■Conductive film formation process

Ishii's inkjet system is used to efficiently use expensive conductive materials without waste, contributing to cost and environmental issues.

■Semiconductor process

Semiconductors are essential to life and society, where various things are connected via the internet. Ishii's inkjet system is playing an active role as a technology that guides life and society in a better direction.

  • Product

    Device Inkjet patterning model All-in-one inkjet coating device (high-definition model)

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1 Models of Device Inkjet patterning model All-in-one inkjet coating device (high-definition model)

Image Part Number Price (excluding tax) Applicable Compatible ink Equipment size Board type Coating type Coating speed Coating area
Device Inkjet patterning model All-in-one inkjet coating device (high-definition model)-Part Number-IP300-P

IP300-P

Available upon quote

For mass production

Solvent-based, UV-based, particle-containing type
(conductive ink, insulating ink, resist ink, adhesive, etc.)

3,250 W x 2,600 D x 2,350 H mm

Wafer, glass, metal plate, resin substrate, PCB, PC, etc.

Patterning/partial coating

Max. 350 mm/sec

Max. 300 x 300 mm or Φ300 mm

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Ishii Notation Co., Ltd.

  • Japan

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