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Patterning model Inkjet coating device (high definition/high precision model)-IP400
Patterning model Inkjet coating device (high definition/high precision model)-Ishii Notation Co., Ltd.

Patterning model Inkjet coating device (high definition/high precision model)
Ishii Notation Co., Ltd.


About This Product

■High-definition patterning/partial coating

An all-purpose machine that can perform everything from high-precision, high-definition patterning to partial coating. Particle-containing inks are also available. Recruitment example

■Aligning agent coating process

An alignment agent that is indispensable for liquid crystal panels (LCDs). Ishii's inkjet system is used in highly difficult fields where production volumes are high and quality is required to form thin films on the order of several hundred angstroms.

■Insulating film formation process

An essential insulating layer for all electronic components. Ishii's inkjet system is used to make maximum use of high-performance insulating materials.

■Conductive film formation process

Ishii's inkjet system is used to efficiently use expensive conductive materials without waste, contributing to cost and environmental issues.

■Semiconductor process

Semiconductors are essential to life and society, where various things are connected via the internet. Ishii's inkjet system is playing an active role as a technology that guides life and society in a better direction.

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    Patterning model Inkjet coating device (high definition/high precision model)

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1 Models of Patterning model Inkjet coating device (high definition/high precision model)

Image Part Number Price (excluding tax) Applicable Compatible ink Equipment size Board type Coating type Coating speed Coating area
Patterning model Inkjet coating device (high definition/high precision model)-Part Number-IP400

IP400

Available upon quote

For experiment/prototype/production

Solvent-based, UV-based, particle-containing type
(conductive ink, insulating ink, resist ink, adhesive, etc.)

2,100 W x 3,100 D x 2,350 H mm

Wafer, glass, metal plate, resin substrate, sheet, PCB, PC, etc.

Patterning/partial coating

Max. 300 mm/sec

Max. 800 x 750 mm

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