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Full/partial coating model All-in-one inkjet coating device (2-component specification model) (4-inch wafer size)-IP100
Full/partial coating model All-in-one inkjet coating device (2-component specification model) (4-inch wafer size)-Ishii Notation Co., Ltd.

Full/partial coating model All-in-one inkjet coating device (2-component specification model) (4-inch wafer size)
Ishii Notation Co., Ltd.


About This Product

■Summary

Fully automatic inkjet coating equipment A 2-liquid wafer model that can perform the entire process from 2 cassettes → transport → wafer alignment → IJ coating → drying. Recruitment example

■Aligning agent coating process

An alignment agent that is indispensable for liquid crystal panels (LCDs). Ishii's inkjet system is used in highly difficult fields where production volumes are high and quality is required to form thin films on the order of several hundred angstroms.

■Insulating film formation process

An essential insulating layer for all electronic components. Ishii's inkjet system is used to make maximum use of high-performance insulating materials.

■Conductive film formation process

Ishii's inkjet system is used to efficiently use expensive conductive materials without waste, contributing to cost and environmental issues.

■Semiconductor process

Semiconductors are essential to life and society, where various things are connected via the internet. Ishii's inkjet system is playing an active role as a technology that guides life and society in a better direction.

  • Product

    Full/partial coating model All-in-one inkjet coating device (2-component specification model) (4-inch wafer size)

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1 Models of Full/partial coating model All-in-one inkjet coating device (2-component specification model) (4-inch wafer size)

Image Part Number Price (excluding tax) Applicable Compatible ink Equipment size Board type Coating type Coating speed Coating area
Full/partial coating model All-in-one inkjet coating device (2-component specification model) (4-inch wafer size)-Part Number-IP100

IP100

Available upon quote

For mass production

Solvent-based, UV-based
(conductive ink, insulating ink, resist ink, adhesive, etc.)

2,780 W x 2,280 D x 2,320 H mm

Wafers, glass, metal plates, resin substrates, PCs, etc.

Full/partial coating

Max. 350 mm/sec

Max. Φ100 mm

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