Printed circuit board/electronic device manufacturing equipment Advanced 84μm compatible HS polishing machine with excellent transport stability
Ishii Notation Co., Ltd.
About This Product
■Summary
This is a world standard buffing machine that has evolved from the previous model and is capable of polishing both sides of ultra-thin substrates with a thickness of 84μm. In addition to a fixed backup type for thin plates, we also have a moving backup type that can process anything from thin to thick plates, allowing you to select a versatile machine depending on the thickness of the board. In addition to various pre-treatment processes, it also demonstrates outstanding performance in processes that require heavy grinding, and can be used in a wide range of applications.
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Product
Printed circuit board/electronic device manufacturing equipment Advanced 84μm compatible HS polishing machine with excellent transport stability
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Handling Company
Ishii Notation Co., Ltd.
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Categories
1 Models of Printed circuit board/electronic device manufacturing equipment Advanced 84μm compatible HS polishing machine with excellent transport stability
| Product Image | Part Number | Price (excluding tax) | Effective processing width | Processed plate thickness | Work size |
|---|---|---|---|---|---|
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HS-700 |
Available upon quote | 700mm | 0.084~8.0mm | W220×L220~W700×L700mm |
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About Company Handling This Product
- Japan