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  4. Printed circuit board/electronic device manufacturing equipment Advanced 84μm compatible HS polishing machine with excellent transport stability (Ishii Notation Co., Ltd.)
Printed circuit board/electronic device manufacturing equipment Advanced 84μm compatible HS polishing machine with excellent transport stability-HS-700
Printed circuit board/electronic device manufacturing equipment Advanced 84μm compatible HS polishing machine with excellent transport stability-Ishii Notation Co., Ltd.

Printed circuit board/electronic device manufacturing equipment Advanced 84μm compatible HS polishing machine with excellent transport stability
Ishii Notation Co., Ltd.

About This Product

■Summary

This is a world standard buffing machine that has evolved from the previous model and is capable of polishing both sides of ultra-thin substrates with a thickness of 84μm. In addition to a fixed backup type for thin plates, we also have a moving backup type that can process anything from thin to thick plates, allowing you to select a versatile machine depending on the thickness of the board. In addition to various pre-treatment processes, it also demonstrates outstanding performance in processes that require heavy grinding, and can be used in a wide range of applications.

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    Printed circuit board/electronic device manufacturing equipment Advanced 84μm compatible HS polishing machine with excellent transport stability

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1 Models of Printed circuit board/electronic device manufacturing equipment Advanced 84μm compatible HS polishing machine with excellent transport stability

Image Part Number Price (excluding tax) Effective processing width Processed plate thickness Work size
Printed circuit board/electronic device manufacturing equipment Advanced 84μm compatible HS polishing machine with excellent transport stability-Part Number-HS-700

HS-700

Available upon quote

700mm

0.084~8.0mm

W220×L220~W700×L700mm

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About Company Handling This Product

Ishii Notation Co., Ltd.

  • Japan

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