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  4. Printed circuit board/electronic device manufacturing equipment Employs horizontal buff removal method and automatic pressure adjustment mechanism Highly rigid frame supports heavy grinding NT polishing machine (Ishii Notation Co., Ltd.)
Printed circuit board/electronic device manufacturing equipment Employs horizontal buff removal method and automatic pressure adjustment mechanism Highly rigid frame supports heavy grinding NT polishing machine-NT-700IM
Printed circuit board/electronic device manufacturing equipment Employs horizontal buff removal method and automatic pressure adjustment mechanism Highly rigid frame supports heavy grinding NT polishing machine-Ishii Notation Co., Ltd.

Printed circuit board/electronic device manufacturing equipment Employs horizontal buff removal method and automatic pressure adjustment mechanism Highly rigid frame supports heavy grinding NT polishing machine
Ishii Notation Co., Ltd.

About This Product

■Summary

In addition to being used in all pre-processing processes in printed circuit board manufacturing, its highly rigid frame is also effective in heavy grinding, and it is capable of high-quality processing such as hole-filling ink removal polishing and resin polishing, and is suitable for build-up boards and Also ideal for polishing package substrates. All drive parts are located outside the main body frame, so workability is excellent, and transport roll replacement and other maintenance are easy.

■Applications/Features

・9-axis polishing line ・Distributor + single-sided 1-axis polisher + double-sided 4-axis polisher + double-sided 4-axis polisher + washing/drying machine - The automatic pressure regulating oscillation polishing machine has high rigidity and precision, and at the same time has a long life. It is used in applications that require precision polishing, such as hole-filling ink removal polishing and build-up boards.

  • Product

    Printed circuit board/electronic device manufacturing equipment Employs horizontal buff removal method and automatic pressure adjustment mechanism Highly rigid frame supports heavy grinding NT polishing machine

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1 Models of Printed circuit board/electronic device manufacturing equipment Employs horizontal buff removal method and automatic pressure adjustment mechanism Highly rigid frame supports heavy grinding NT polishing machine

Image Part Number Price (excluding tax) Effective processing width Processed plate thickness Work size
Printed circuit board/electronic device manufacturing equipment Employs horizontal buff removal method and automatic pressure adjustment mechanism Highly rigid frame supports heavy grinding NT polishing machine-Part Number-NT-700IM

NT-700IM

Available upon quote

700mm

0.124~3.2mm

W220×L220~W700×L700mm

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About Company Handling This Product

Ishii Notation Co., Ltd.

  • Japan

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