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  4. Printed circuit board/electronic device manufacturing equipment Capable of polishing ultra-thin substrates of 54 μm New ultra-thin substrate polishing machine (Ishii Notation Co., Ltd.)
Printed circuit board/electronic device manufacturing equipment Capable of polishing ultra-thin substrates of 54 μm New ultra-thin substrate polishing machine-ETⅡ-700
Printed circuit board/electronic device manufacturing equipment Capable of polishing ultra-thin substrates of 54 μm New ultra-thin substrate polishing machine-Ishii Notation Co., Ltd.

Printed circuit board/electronic device manufacturing equipment Capable of polishing ultra-thin substrates of 54 μm New ultra-thin substrate polishing machine
Ishii Notation Co., Ltd.

About This Product

■Summary

A new type of ultra-thin substrate polishing machine that can polish ultra-thin substrates of 54μm. We have further evolved the conventional E T type, making it possible to polish general-purpose products in addition to polishing thin plates that were previously impossible. While following the double-sided simultaneous polishing method, we have adopted a horizontal method, which has led to increased production efficiency. This polishing system maintains constant polishing pressure on both sides of the substrate, reducing warping after polishing thin plates. We have succeeded in eliminating to the utmost the occurrence of bends and dents at the edges of the substrate, which were problems when polishing thin plates. This is a cutting-edge polishing machine that is unique in the industry and will play an important role in future PCB manufacturing, developed by Ishii Hyoki.

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    Printed circuit board/electronic device manufacturing equipment Capable of polishing ultra-thin substrates of 54 μm New ultra-thin substrate polishing machine

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1 Models of Printed circuit board/electronic device manufacturing equipment Capable of polishing ultra-thin substrates of 54 μm New ultra-thin substrate polishing machine

Image Part Number Price (excluding tax) Effective processing width Processed plate thickness Work size
Printed circuit board/electronic device manufacturing equipment Capable of polishing ultra-thin substrates of 54 μm New ultra-thin substrate polishing machine-Part Number-ETⅡ-700

ETⅡ-700

Available upon quote

700mm

0.054~2.0mm

W260 × L260~W700 × L700mm

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Ishii Notation Co., Ltd.

  • Japan

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