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  2. Vacuum equipment diffusion bonding equipment (Atotech Co., Ltd.)
Vacuum equipment diffusion bonding equipment-Vacuum equipment diffusion bonding equipment
Vacuum equipment diffusion bonding equipment-Atotech Co., Ltd.

Vacuum equipment diffusion bonding equipment
Atotech Co., Ltd.

Atotech Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

133.9hours

About This Product

This is a vacuum device that joins metals at the atomic level. Using our vacuum technology, we designed and manufactured a high-performance diffusion bonding device. By using diffusion bonding equipment, it is possible to bond the same materials together, and it is also possible to bond different materials. Other processing methods have the disadvantage of melting the materials when joining, but diffusion bonding, which joins materials without melting them, allows for more precise processing and joining of minute materials. can. Characteristics of diffusion bonding include the fact that there is little material deformation when bonded, and the ability to stack multiple layers, making it possible to create shapes that were impossible with conventional processing methods. If it is difficult to join materials as desired using welding, etc., you may want to try diffusion bonding. The micro-diffusion bonding equipment allows you to adjust the temperature using a program, so by precisely controlling the temperature, you can perform advanced diffusion bonding. Diffusion bonding used to be used in only a few fields, but now diffusion bonding equipment is used in many fields such as information communications, semiconductor manufacturing equipment, and electrical and electronic components.

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    Vacuum equipment diffusion bonding equipment

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1 Models of Vacuum equipment diffusion bonding equipment

Image Part Number Price (excluding tax) High frequency power supply Degree of vacuum Maximum heating temperature Heating method Heating dimensions Pressure method
Vacuum equipment diffusion bonding equipment-Part Number-Vacuum equipment diffusion bonding equipment

Vacuum equipment diffusion bonding equipment

Available upon quote

20KW

X10-5PA

1,400℃

High frequency, programmable temperature control

40φx40H

Weighting method using weight + lever

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About Company Handling This Product

Atotech Co., Ltd.

Response Rate

100.0%

Response Time

133.9hrs

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