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LID for SMD package-LID for SMD package
LID for SMD package-Yudensha Co., Ltd.

LID for SMD package
Yudensha Co., Ltd.


About This Product

The LID for SMD packages, which is a thin component with a thickness of 50 μm that easily overlaps, is uniformly plated with nickel to improve corrosion resistance and weldability, making it possible to seal ceramic packages. By investigating the movement of the product and current distribution during barrel plating, we have realized plating processing for thin plate products that are generally considered impossible with barrel plating.

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    LID for SMD package

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