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Fuse holder FH-B13HA-FH-B13HA
Fuse holder FH-B13HA-Echo Electronics Co., Ltd.

About This Product

■Rating

10A

■Operating temperature range

-20~60℃

■Applicable fuse

Φ5.2*20

■Standard test condition

Normal temperature (5-35℃), normal humidity (45-85%RH), normal pressure (860-1060hPa). However, if there is any doubt about the judgment, the test should be performed at 20±2℃, 60-70%RH, and 860-1060hPa. Parts used

■Cylinder molding

・Material: Phenol resin ・Flame retardant UL94V-0

■Head molding

・Material: Phenol resin ・Flame retardant UL94V-0

■Head fitting

・Material: Copper alloy ・Processing tin plating

■Coil spring

・Material piano wire ・Processing nickel plating

■Narrow rug

・Material: Copper alloy ・Processing nickel plating

■Side terminal

・Material: Copper alloy ・Processing tin plating

■End terminal

・Material: Copper alloy ・Processing tin plating

■Notes

The dummy fuse used for measurements is brass (gold plated) Φ5.2 x 20 mm.

■Reference

This product complies with the Electrical Appliance and Material Safety Law.

  • Product

    Fuse holder FH-B13HA

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1 Models of Fuse holder FH-B13HA

Image Part Number Price (excluding tax) Head tightening strength Electrical durability Withstand voltage Heat resistance Moisture resistance Cold resistance Insulation resistance Contact resistance Solder heat resistance Solderability
Fuse holder FH-B13HA-Part Number-FH-B13HA

FH-B13HA

Available upon quote

No abnormalities in appearance or structure

Temperature rise: 30℃ or less, no electrical or mechanical abnormalities

No dielectric breakdown

Insulation resistance: 10MΩ or more, contact resistance, and withstand voltage must be satisfied.

Insulation resistance: 10MΩ or more, contact resistance, and withstand voltage must be satisfied.

Insulation resistance: 10MΩ or more, contact resistance, and withstand voltage must be satisfied.

100MΩ or more

20mΩ or less

Satisfies contact resistance, insulation resistance, and withstand voltage requirements, and there is no significant play in the terminal due to deformation of the resin.

At least 75% of the dipped area must be covered with solder.

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