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Fuse holder FH-B12-FH-B12
Fuse holder FH-B12-Echo Electronics Co., Ltd.

About This Product

■Rating

・10A (UL/CSA/VDE) ・6.3A (SEMKO)

■Operating temperature range

-20~60℃

■Applicable fuse

Φ5.2*20

■Mounting plate thickness

0.8/1.0/1.2/1.6/2.0

■Standard test condition

Normal temperature (5-35℃), normal humidity (45-85%RH), normal pressure (860-1060hPa). However, if there is any doubt about the judgment, the test should be performed at 20±2℃, 60-70%RH, and 860-1060hPa. Parts used

■Head molding

・Material: Phenol resin ・Flame retardant UL94V-0

■Head fitting

・Material: Copper alloy ・Processing Tin plating

■Coil spring

・Material piano wire ・Processing nickel plating

■Narrow rug

・Material: Copper alloy ・Processing nickel plating

■Cylinder molding

・Material: Phenol resin ・Flame retardant UL94V-0

■Side terminal

・Material: Copper alloy ・Processing tin plating

■End terminal

・Material: Copper alloy ・Processing tin plating

■Holding metal fittings

Material stainless steel

■Notes

The dummy fuse used for measurements is brass (gold plated) Φ5.2 x 20 mm.

■Reference

This product complies with the Electrical Appliance and Material Safety Law.

  • Product

    Fuse holder FH-B12

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1 Models of Fuse holder FH-B12

Image Part Number Price (excluding tax) Head tightening strength Electrical durability Withstand voltage Heat resistance Moisture resistance Cold resistance Insulation resistance Contact resistance Solder heat resistance Solderability
Fuse holder FH-B12-Part Number-FH-B12

FH-B12

Available upon quote

No abnormalities in appearance or structure

Temperature rise: 30℃ or less, no electrical or mechanical abnormalities

No dielectric breakdown

Insulation resistance: 10MΩ or more, contact resistance, and withstand voltage must be satisfied.

Insulation resistance: 10MΩ or more, contact resistance, and withstand voltage must be satisfied.

Insulation resistance: 10MΩ or more, contact resistance, and withstand voltage must be satisfied.

100MΩ or more

20mΩ or less

There shall be no abnormalities such as deformation of appearance.

At least 95% of the dipped area must be covered with solder.

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