3D measuring instrument Wafer thickness measurement system
COMS Co., Ltd.
About This Product
■Wafer thickness measurement system
This system allows for non-contact, highly accurate, and easy measurement of wafer thickness. Easy settings using dedicated software allow for highly accurate positioning, two non-contact laser displacement sensors to measure displacement on the front and back sides of the wafer, and automatic data collection to Excel or CSV files. Customization is possible according to wafer size and measurement method.
■Non-contact measurement that does not damage the wafer
The front and back surfaces of the wafer are scanned with laser light without contact, so there is no damage to the wafer. In addition, contamination prevention specifications such as Teflon coating on the wafer installation surface and peak material specifications for the guide pins are applied.
■Application software for wafer thickness measurement
You can easily start measurement by selecting the wafer size and measurement method using dedicated software specialized for wafer thickness measurement, and measurement data is automatically collected into an Excel sheet or CSV file. An Excel sheet for determining results is provided as standard, allowing for maximum value, minimum value, average value, tolerance determination, TTV (reference value), warpage measurement, graph display, etc. on Excel. You can also create any result calculations in Excel.
■Selectable from commercially available laser displacement sensors
The most suitable type of laser displacement sensor can be selected from commercially available laser displacement sensors and installed. Flexible system configurations are possible to suit the specifications of the wafer to be measured, accuracy, usage environment, budget, etc.
■Customization options available
・Wafer size, stage stroke, etc.
・Optional cover
・Optional vibration isolation table
■Preliminary actual machine test
Using demo devices, customers can confirm in advance whether measurements can be made on their actual wafers or reference workpieces, and how it compares with conventional methods. Please feel free to contact us.
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Product
3D measuring instrument Wafer thickness measurement system
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Handling Company
COMS Co., Ltd.
1 Models of 3D measuring instrument Wafer thickness measurement system
| Product Image | Part Number | Price (excluding tax) | Automated stage system section Measurable wafer size | Automated stage system section Repeatable positioning accuracy | Automated stage system section dead weight | Automatic stage system department Lost motion | Automatic stage system department backlash | Automatic stage system motor | Automatic stage system movement amount | Automatic stage system positioning accuracy | Automatic stage system section Parallelism A | Automatic stage system section feeding method | Automatic stage system section guide method | Automatic stage system section load capacity | Automatic stage system section maximum movement speed | Automatic stage system section movement direction | Automatic stage system section movement resolution | Automatic stage system straightness (horizontal/vertical) | Controller acceleration/deceleration time | Controller input voltage/current consumption | Controller interface | Controller maximum drive speed | Controller minimum drive speed | Controller part Number of control axes | Controller part model | Controller unit maximum power consumption | Laser displacement sensor measurement range | Laser displacement sensor section measurement resolution | Laser displacement sensor section sensor head position adjustment | Laser displacement sensor unit measurement reference distance | Laser displacement sensor unit repeatability | Number of controller divisions (when using CP-D7) |
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WAP-100XY |
Available upon quote | 2,3,4 inches | ±1μm | 92kg | 5μm | 1μm | 0.75A/phase 5-phase stepping motor | 100×100mm | 15μm | 15μm | Precision ball screw lead 5mm | Linear slide guide | 15kg | 30mm/sec | XY axis | 0.5μm (number of divisions: when set to 1/20) | 10μm | 0~65,535msec | DC21.6~26.4V (DC24V±10%) /0.5A | USB (ver1.1) | 4Mpps (high precision interpolation: 500kpps) | 1pps | 2 axes | CP-700M | 250VA (when using optional AC adapter AD-100N) |
±1mm *This is an example of the accuracy of a single laser displacement meter that can be installed in the system. Actual accuracy varies depending on the type of laser displacement meter, object to be measured, required specifications, etc. |
0.01μm *This is an example of the accuracy of a single laser displacement meter that can be installed in the system. Actual accuracy varies depending on the type of laser displacement meter, object to be measured, required specifications, etc. |
Manual stage with micrometer head |
10mm *This is an example of the accuracy of a single laser displacement meter that can be installed in the system. Actual accuracy varies depending on the type of laser displacement meter, object to be measured, required specifications, etc. |
0.01μm *This is an example of the accuracy of a single laser displacement meter that can be installed in the system. Actual accuracy varies depending on the type of laser displacement meter, object to be measured, required specifications, etc. |
1 to 250 divisions, 16 steps switching |
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About Company Handling This Product
- Japan