3D measuring instrument Wafer thickness measurement system-WAP-100XY

3D measuring instrument Wafer thickness measurement system
COMS Co., Ltd.

COMS Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

21.0hours

Relatively Fast Response

About This Product

■Wafer thickness measurement systemThis system allows for non-contact, highly accurate, and easy measurement of wafer thickness. Easy settings using dedicated software allow for highly accurate positioning, two non-contact laser displacement sensors to measure displacement on the front and back sides of the wafer, and automatic data collection to Excel or CSV files. Customization is possible according to wafer size and measurement method.

■Non-contact measurement that does not damage the waferThe front and back surfaces of the wafer are scanned with laser light without contact, so there is no damage to the wafer. In addition, contamination prevention specifications such as Teflon coating on the wafer installation surface and peak material specifications for the guide pins are applied.

■Application software for wafer thickness measurementYou can easily start measurement by selecting the wafer size and measurement method using dedicated software specialized for wafer thickness measurement, and measurement data is automatically collected into an Excel sheet or CSV file. An Excel sheet for determining results is provided as standard, allowing for maximum value, minimum value, average value, tolerance determination, TTV (reference value), warpage measurement, graph display, etc. on Excel. You can also create any result calculations in Excel.

■Selectable from commercially available laser displacement sensorsThe most suitable type of laser displacement sensor can be selected from commercially available laser displacement sensors and installed. Flexible system configurations are possible to suit the specifications of the wafer to be measured, accuracy, usage environment, budget, etc.

■Customization options available・Wafer size, stage stroke, etc.
・Optional cover
・Optional vibration isolation table

■Preliminary actual machine testUsing demo devices, customers can confirm in advance whether measurements can be made on their actual wafers or reference workpieces, and how it compares with conventional methods. Please feel free to contact us.

Model
There are 1 models for this product.

Product
3D measuring instrument Wafer thickness measurement system

Handling Company
COMS Co., Ltd.

80+ people viewing

Last viewed: 50 minutes ago

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1 Models of 3D measuring instrument Wafer thickness measurement system

Image	Part Number	Price (excluding tax)	Automatic stage system section feeding method	Automated stage system section dead weight	Automatic stage system section load capacity	Automated stage system section Repeatable positioning accuracy	Automatic stage system movement amount	Automatic stage system section movement direction	Automatic stage system section movement resolution	Automatic stage system straightness (horizontal/vertical)	Automated stage system section Measurable wafer size	Automatic stage system section maximum movement speed	Automatic stage system section Parallelism A	Automatic stage system positioning accuracy	Automatic stage system department Lost motion	Automatic stage system motor	Automatic stage system department backlash	Automatic stage system section guide method	Laser displacement sensor unit repeatability	Laser displacement sensor measurement range	Laser displacement sensor unit measurement reference distance	Laser displacement sensor section measurement resolution	Laser displacement sensor section sensor head position adjustment	Controller minimum drive speed	Controller maximum drive speed	Controller unit maximum power consumption	Controller part model	Controller acceleration/deceleration time	Controller part Number of control axes	Number of controller divisions (when using CP-D7)	Controller input voltage/current consumption	Controller interface
	WAP-100XY	Available upon quote	Precision ball screw lead 5mm	92kg	15kg	±1μm	100×100mm	XY axis	0.5μm (number of divisions: when set to 1/20)	10μm	2,3,4 inches	30mm/sec	15μm	15μm	5μm	0.75A/phase 5-phase stepping motor	1μm	Linear slide guide	0.01μm *This is an example of the accuracy of a single laser displacement meter that can be installed in the system. Actual accuracy varies depending on the type of laser displacement meter, object to be measured, required specifications, etc.	±1mm *This is an example of the accuracy of a single laser displacement meter that can be installed in the system. Actual accuracy varies depending on the type of laser displacement meter, object to be measured, required specifications, etc.	10mm *This is an example of the accuracy of a single laser displacement meter that can be installed in the system. Actual accuracy varies depending on the type of laser displacement meter, object to be measured, required specifications, etc.	0.01μm *This is an example of the accuracy of a single laser displacement meter that can be installed in the system. Actual accuracy varies depending on the type of laser displacement meter, object to be measured, required specifications, etc.	Manual stage with micrometer head	1pps	4Mpps (high precision interpolation: 500kpps)	250VA (when using optional AC adapter AD-100N)	CP-700M	0~65,535msec	2 axes	1 to 250 divisions, 16 steps switching	DC21.6~26.4V (DC24V±10%) /0.5A	USB (ver1.1)

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About Company Handling This Product

COMS Co., Ltd.

Response Rate

100.0%

Response Time

21.0hrs

Japan

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3D measuring instrument Wafer thickness measurement system COMS Co., Ltd.

COMS Co., Ltd.'s Response Status

About This Product

■Wafer thickness measurement system

■Non-contact measurement that does not damage the wafer

■Application software for wafer thickness measurement

■Selectable from commercially available laser displacement sensors

■Customization options available

■Preliminary actual machine test

1 Models of 3D measuring instrument Wafer thickness measurement system

WAP-100XY

Other products of COMS Co., Ltd.

About Company Handling This Product

3D measuring instrument Wafer thickness measurement system
COMS Co., Ltd.