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  4. Materials for semiconductor package substrates Prepreg materials (Sumitomo Bakelite Co., Ltd.)
Materials for semiconductor package substrates Prepreg materials-LAZ-2002
Materials for semiconductor package substrates Prepreg materials-Sumitomo Bakelite Co., Ltd.

Materials for semiconductor package substrates Prepreg materials
Sumitomo Bakelite Co., Ltd.

About This Product

■Features

Thanks to its characteristics such as low coefficient of thermal expansion, low dimensional change, high Tg, and high heat resistance, it can meet the demands for high reliability, thinness, and high-density packaging of packages.

■Summary

Prepreg materials provided by Sumitomo Bakelite (LAZ-6785 series)

■Applications

・Electronics/Electronics ・Applications that require high reliability and thinness, such as semiconductor package substrates and module substrates

  • Product

    Materials for semiconductor package substrates Prepreg materials

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1 Models of Materials for semiconductor package substrates Prepreg materials

Image Part Number Price (excluding tax) Elastic modulus (30deg.C, GPa) Elastic modulus (260deg.C, GPa) Water absorption rate (D-24/23, %) Thickness (um) Peel strength (kN/m) Glass cloth (#) Glass cloth (Type) Tg (DMA, deg.C) Dk (1GHz) Df (1GHz) CTE-1 (XY) (TMA, ppm/C)
Materials for semiconductor package substrates Prepreg materials-Part Number-LAZ-2002

LAZ-2002

Available upon quote

Twenty two

11

0.35

40

0.8

1037

S

200

3.9

0.008

7

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About Company Handling This Product

Sumitomo Bakelite Co., Ltd.

Company Overview

Colibrys, a joint company established in 2001 and headquartered in Yverdon-les-Bains, Switzerland, is a manufa...

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Prepregs
Prepregs　Sumitomo Bakelite Co., Ltd.
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