All Categories
History
Product
Materials for semiconductor package substrates Core materialsHandling Company
Sumitomo Bakelite Co., Ltd.| Image | Part Number | Price (excluding tax) | Features | Thermal conductivity (W/m・k) | Thinnest thickness (production results, um) | Maximum thickness (production results, um) | Elastic modulus (30degC, GPa) | Elastic modulus (260degC, GPa) | Water absorption rate (D-24/23, wt%) | Thickness (nominal, um) | Peel strength (12LP copper foil, kN/m) | Glass cloth count (# for 100um thickness) | Glass cloth count (Type for 100um thickness) | Tg (DMA, deg.C) | Dk (1GHz) | Df (1GHz) | CTE-1z (TMA, ppm/C) | CTE-1xy (TMA, ppm/C) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
LAZ-4785 (TH-G) |
Available upon quote |
Low CTE |
0.7 |
Twenty five |
150 |
32 |
Twenty one |
0.4 |
100 |
0.7 |
2116 |
S |
255 |
4 |
0.005 |
12 |
4 |
Reviews shown here are reviews of companies.
