Dicing tape/UV release adhesive tape (Sumilite® FSL)-N5000 series

Dicing tape/UV release adhesive tape (Sumilite® FSL)
Sumitomo Bakelite Co., Ltd.

About This Product

■IntroductionAdhesive tape for the dicing process of semiconductors, etc. A UV-curable dicing tape that reliably holds silicon wafers, resin substrates, and other adherends, the tape developed by Sumitomo Bakelite maintains the balance of the three adhesive elements: tack strength, adhesion strength, and cohesive strength, while maintaining the customer's needs. It is designed to exhibit performance that matches a variety of required characteristics.

Features
■The industry's highest level of "antistatic property"Antistatic material is blended into the base film to suppress problems caused by electrostatic damage.

■Good "adhesiveness and pick-up properties" for various adherend materialsWe have achieved adhesion and pick-up properties that are suitable for a wide range of adherend materials, such as silicone and encapsulants.

■Low contamination on the surface and sides of wafers and substratesDue to its low contamination properties achieved through our proprietary adhesive compounding technology, it has been highly evaluated primarily for image sensor applications.

■ApplicationsElectronics/Electronics
Semiconductors (wafer holding tape for dicing process, resin substrate holding tape for dicing process, other adherend holding tape for dicing process, chip transfer/replacement, and other applications that require adhesive force control)

■Usage example・Wafers, resin substrates, and other adherends
-We have N6000 and 8000 series product numbers for dicing tape for wafers. For resin substrates, please consider the N5000 series. Please contact us for other adherend applications.

Model
There are 1 models for this product.

Product
Dicing tape/UV release adhesive tape (Sumilite® FSL)

Handling Company
Sumitomo Bakelite Co., Ltd.

Categories

Adhesives & Repair Materials

Adhesive Tapes

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1 Models of Dicing tape/UV release adhesive tape (Sumilite® FSL)

Image	Part Number	Price (excluding tax)	Purpose
	N5000 series	Available upon quote	For packages, for resin substrates

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About Company Handling This Product

Sumitomo Bakelite Co., Ltd.

Company Overview

Colibrys, a joint company established in 2001 and headquartered in Yverdon-les-Bains, Switzerland, is a manufa...

Japan

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Dicing tape/UV release adhesive tape (Sumilite® FSL) Sumitomo Bakelite Co., Ltd.

About This Product

■Introduction

■The industry's highest level of "antistatic property"

■Good "adhesiveness and pick-up properties" for various adherend materials

■Low contamination on the surface and sides of wafers and substrates

■Applications

■Usage example

1 Models of Dicing tape/UV release adhesive tape (Sumilite® FSL)

N5000 series

Customers who viewed this product also viewed

Other products of Sumitomo Bakelite Co., Ltd.

About Company Handling This Product

Related search keywords

Dicing tape/UV release adhesive tape (Sumilite® FSL)
Sumitomo Bakelite Co., Ltd.