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  4. Paste for die bonding Sumiresin Excel®CRM (Sumitomo Bakelite Co., Ltd.)
Paste for die bonding Sumiresin Excel®CRM-1577EG
Paste for die bonding Sumiresin Excel®CRM-Sumitomo Bakelite Co., Ltd.

Paste for die bonding Sumiresin Excel®CRM
Sumitomo Bakelite Co., Ltd.

About This Product

Features

■Contributes to reliability and heat dissipation

The CRM series is a one-component paste that contributes to improving the reliability of semiconductor die bonding materials for general-purpose packages, thin and large packages, and advanced packages. In addition to die bonding, it is also widely used for joining various electronic device components. We also offer high thermal conductivity die bonding materials that utilize sintering technology and are used in LEDs, etc. overview

■Role of CRM

・Joining various parts ・Relief of internal stress ・Release heat to the outside ・Electricity flows/does not flow etc.

■Applications

Bonding of IC chips and various parts (TIM1, TIM2, lid attach applications, etc.)

  • Product

    Paste for die bonding Sumiresin Excel®CRM

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1 Models of Paste for die bonding Sumiresin Excel®CRM

Image Part Number Price (excluding tax) Features Thermal conductivity (W/mK) Resin type Recommended curing temperature (maximum temperature after heating) Elastic modulus @25℃ (MPa) Elastic modulus @250℃ (MPa) Classification Filler type
Paste for die bonding Sumiresin Excel®CRM-Part Number-1577EG

1577EG

Available upon quote

Instant curing

0.3

Acrylic

170℃/2min

1,400

140

Insulation

Organic filler

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About Company Handling This Product

Sumitomo Bakelite Co., Ltd.

Company Overview

Colibrys, a joint company established in 2001 and headquartered in Yverdon-les-Bains, Switzerland, is a manufa...

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