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Ultra-compact mold temperature controller TEMPCON water specification TSC-100B-TSC-100B
Ultra-compact mold temperature controller TEMPCON water specification TSC-100B-Toyo Sansho Co., Ltd.

Ultra-compact mold temperature controller TEMPCON water specification TSC-100B
Toyo Sansho Co., Ltd.


About This Product

■Features

・Water is used as the medium, but it can be heated up to 140℃. -Equipped with a specially designed high-pressure, high-flow pump. ・Equipped with a heat protector, pressure switch, thermal relay, and bypass piping as safety devices. - All piping materials and base materials are made of SUS304, making them less likely to rust. -The temperature controller uses a PID control method, allowing highly accurate control. - A shatterproof cover is installed in case of pump water leakage. - Built-in booster pump.

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    Ultra-compact mold temperature controller TEMPCON water specification TSC-100B

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1 Models of Ultra-compact mold temperature controller TEMPCON water specification TSC-100B

Image Part Number Price (excluding tax) Power supply voltage Electric capacity Weight Piping diameter Heat medium Temperature controller control method Maximum flow rate Maximum pressure Dimensions (mm) Media maximum temperature Media minimum temperature Paint color Cooling capacity Cooling method Pump method Heater capacity Accessories
Ultra-compact mold temperature controller TEMPCON water specification TSC-100B-Part Number-TSC-100B

TSC-100B

Available upon quote

Main circuit AC200V 50/60Hz 3P Operation circuit AC200V 50/60Hz 1P

5.0KVA

37.0kg

Circulation system 10A (3/8B) Cooling system 10A (3/8B)

Water (Oil cannot be used)

PID control method

30L/min

0.40MPa

D515×W240×H370

140℃

Supply cooling water temperature + inlet/outlet temperature difference (usually around 10~30℃)

Main body sky blue panel black

2,000Kcal/h Cooling water inlet/outlet T=30℃ P=0.2MPa

Direct cooling method

Cascade method

3.0KW

Power cable 5m without hose

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