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Ultra-compact mold temperature controller TEMPCON water specification TSC-200-TSC-200
Ultra-compact mold temperature controller TEMPCON water specification TSC-200-Toyo Sansho Co., Ltd.

Ultra-compact mold temperature controller TEMPCON water specification TSC-200
Toyo Sansho Co., Ltd.


About This Product

■Features

・Water is used as the medium, but it can be heated up to 95℃. -Equipped with a specially designed high-pressure, high-flow pump. ・Equipped with a heat protector, pressure switch, thermal relay, and bypass piping as safety devices. - All piping materials and base materials are made of SUS304, making them less likely to rust. -The temperature controller uses a PID control method, allowing for highly accurate control.

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    Ultra-compact mold temperature controller TEMPCON water specification TSC-200

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1 Models of Ultra-compact mold temperature controller TEMPCON water specification TSC-200

Image Part Number Price (excluding tax) Power supply voltage Electric capacity Weight Piping diameter Heat medium Temperature controller control method Maximum flow rate Maximum pressure Dimensions (mm) Media maximum temperature Media minimum temperature Paint color Cooling capacity Cooling method Pump method Heater capacity Accessories
Ultra-compact mold temperature controller TEMPCON water specification TSC-200-Part Number-TSC-200

TSC-200

Available upon quote

Main circuit AC200V 50/60Hz 3P Operation circuit AC200V 50/60Hz 1P

8.5KVA

35.0kg

Circulation system 20A (3/4B) Cooling system 10A (3/8B)

Water (Oil cannot be used)

PID control method

50L/min

0.35MPa

D515×W240×H370

95℃

Supply cooling water temperature + inlet/outlet temperature difference (usually around 10~30℃)

Main body sky blue panel black

2,000Kcal/h Cooling water inlet/outlet T=30℃ P=0.2MPa

Direct cooling method

Cascade method

6KW

Power cable 5m without hose

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