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  4. Next-generation high-precision bond tester Easier data management Universal bond tester System 650 (Hugle Electronics Co., Ltd.)
Next-generation high-precision bond tester Easier data management Universal bond tester System 650-System 650
Next-generation high-precision bond tester Easier data management Universal bond tester System 650-Hugle Electronics Co., Ltd.

Next-generation high-precision bond tester Easier data management Universal bond tester System 650
Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

51.6hours

About This Product

Next generation high precision bond tester. Easy data management is achieved using the Windows-based software "Bond Test Manager." It is also equipped with an image capture function that allows you to check the breakage status on a monitor after a share test. Supports bump shear test on 300mm wafer.

■Product overview

・This device can be used for a wide range of purposes, from standard tests to custom tests. ・With electric height control microscope - Can be used for various tests such as wire pull, ball shear, die shear, tweezer pull, stud pull, 3-point bend test, heating test, etc. ・300mm wafer and lead frame compatible ・Ultra fine pitch (UFP) compatible ・Image capture option ・Supports die sharing up to 200kgf ・Module tool protection function ・Supports world languages

■Bond Test Manager (Software)

With Bond Test Manager, you can take full advantage of the 650's great capabilities. This software enables real-time data analysis and efficient machine setup. It is also possible to display the measurement results min, max, average, standard deviation, Cpk, X-bar, and range.

■Image capture

You can check the status after the share test on the monitor. Accurate analysis and storage of fracture conditions is possible.

■300mm wafer compatible

You can perform bump shear tests on 300mm wafers.

  • Product

    Next-generation high-precision bond tester Easier data management Universal bond tester System 650

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1 Models of Next-generation high-precision bond tester Easier data management Universal bond tester System 650

Image Part Number Price (excluding tax) Power supply Weight Vacuum Body dimensions Internal PC Position return accuracy Compatible with global standards Loop height measurement Force profile Dry air Servo driven X/Y stage Z resolution X/Y resolution
Next-generation high-precision bond tester Easier data management Universal bond tester System 650-Part Number-System 650

System 650

Available upon quote

110~220VAC50･60Hz

55kg

67kPa

Height-560mm, 25in
Width-432mm, 17in
Depth-585mm, 23in

High-performance PC standard equipment, built-in DVD-CDRW drive, USB, network port

25±1μm

MilStd883, MilStd750, ASTM, JESD22-B117, JESD22-B116, CE marking, RoHS compliant

Possible

Possible

400~550kPa

Standard, 305mm x 155mm

0.1μm

1μm

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About Company Handling This Product

Hugle Electronics Co., Ltd.

Response Rate

100.0%

Response Time

51.6hrs

  • Japan

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Semiconductor Inspection Equipment　Hugle Electronics Co., Ltd.
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