Next-generation high-precision bond tester Easier data management Universal bond tester System 650
Hugle Electronics Co., Ltd.
About This Product
Next generation high precision bond tester. Easy data management is achieved using the Windows-based software "Bond Test Manager." It is also equipped with an image capture function that allows you to check the breakage status on a monitor after a share test. Supports bump shear test on 300mm wafer.
■Product overview
・This device can be used for a wide range of purposes, from standard tests to custom tests.
・With electric height control microscope
- Can be used for various tests such as wire pull, ball shear, die shear, tweezer pull, stud pull, 3-point bend test, heating test, etc.
・300mm wafer and lead frame compatible
・Ultra fine pitch (UFP) compatible
・Image capture option
・Supports die sharing up to 200kgf
・Module tool protection function
・Supports world languages
■Bond Test Manager (Software)
With Bond Test Manager, you can take full advantage of the 650's great capabilities. This software enables real-time data analysis and efficient machine setup. It is also possible to display the measurement results min, max, average, standard deviation, Cpk, X-bar, and range.
■Image capture
You can check the status after the share test on the monitor. Accurate analysis and storage of fracture conditions is possible.
■300mm wafer compatible
You can perform bump shear tests on 300mm wafers.
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Product
Next-generation high-precision bond tester Easier data management Universal bond tester System 650
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Handling Company
Hugle Electronics Co., Ltd.
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Categories
1 Models of Next-generation high-precision bond tester Easier data management Universal bond tester System 650
| Product Image | Part Number | Price (excluding tax) | Body dimensions | Compatible with global standards | Dry air | Force profile | Internal PC | Loop height measurement | Position return accuracy | Power supply | Servo driven X/Y stage | Vacuum | Weight | X/Y resolution | Z resolution |
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System 650 |
Available upon quote |
Height-560mm, 25in Width-432mm, 17in Depth-585mm, 23in |
MilStd883, MilStd750, ASTM, JESD22-B117, JESD22-B116, CE marking, RoHS compliant | 400~550kPa | Possible | High-performance PC standard equipment, built-in DVD-CDRW drive, USB, network port | Possible | 25±1μm | 110~220VAC50･60Hz | Standard, 305mm x 155mm | 67kPa | 55kg | 1μm | 0.1μm |
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