Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800
Hugle Electronics Co., Ltd.
About This Product
Mount the dicing frame and wafer on tape and cut. Can be applied evenly without bubbles. (Supports up to 8 inch wafers) It is also possible to transfer wafers and chips.
■Product overview
- Unique structure allows for uniform attachment without creating air bubbles between the wafer and tape.
・Equipped with a special stage to prevent damage to the wafer surface ・Achieved high reproducibility by using built-in rollers that do not require operator skills.
・It is possible to transfer wafers and chips.
・Manufactured to order at our factory in Japan, and can accommodate special specifications.
・Maximum wafer size 8 inches
・Various dicing frames can be used
・Maximum film width HS-7800: 300mm
・Stage temperature adjustment MAX100℃
・With dicing tape cutting mechanism
・Adjustable pasting pressure
・Can transfer wafers and chips
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Product
Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800
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Handling Company
Hugle Electronics Co., Ltd.
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Categories
1 Models of Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800
| Product Image | Part Number | Price (excluding tax) | Current capacity | Power supply | Size | Vacuum | Weight |
|---|---|---|---|---|---|---|---|
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HS-7800 |
Available upon quote | 3A | AC100V, 50/60Hz | 900 (D) × 400 (W) × 280 (H) mm | 60kPa | 30kg |
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