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Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800-HS-7800
Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800-Hugle Electronics Co., Ltd.

Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800
Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

51.6hours


About This Product

Mount the dicing frame and wafer on tape and cut. Can be applied evenly without bubbles. (Supports up to 8 inch wafers) It is also possible to transfer wafers and chips.

■Product overview

- Unique structure allows for uniform attachment without creating air bubbles between the wafer and tape. ・Equipped with a special stage to prevent damage to the wafer surface ・Achieved high reproducibility by using built-in rollers that do not require operator skills. ・It is possible to transfer wafers and chips. ・Manufactured to order at our factory in Japan, and can accommodate special specifications. ・Maximum wafer size 8 inches ・Various dicing frames can be used ・Maximum film width HS-7800: 300mm ・Stage temperature adjustment MAX100℃ ・With dicing tape cutting mechanism ・Adjustable pasting pressure ・Can transfer wafers and chips

  • Product

    Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800

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1 Models of Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800

Image Part Number Price (excluding tax) Power supply Current capacity Weight Vacuum Size
Mount the dicing frame and wafer on tape and cut. Enables uniform attachment without bubbles. HS-7800-Part Number-HS-7800

HS-7800

Available upon quote

AC100V, 50/60Hz

3A

30kg

60kPa

900 (D) × 400 (W) × 280 (H) mm

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About Company Handling This Product

Response Rate

100.0%


Response Time

51.6hrs

  • Japan

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