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Wafer tape mounting device HS-7600 enables uniform attachment without bubbles-HS-7600
Wafer tape mounting device HS-7600 enables uniform attachment without bubbles-Hugle Electronics Co., Ltd.

Wafer tape mounting device HS-7600 enables uniform attachment without bubbles
Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

51.6hours


About This Product

This is a device that tape mounts wafers. Can be applied evenly without bubbles. (Supports up to 6 inch wafers) It is also possible to transfer wafers and chips.

■Product overview

- Unique structure allows for uniform attachment without creating air bubbles between the wafer and tape. ・Equipped with a special stage to prevent damage to the wafer surface ・Achieved high reproducibility by using built-in rollers that do not require operator skills. ・It is possible to transfer wafers and chips. ・Manufactured to order at our factory in Japan, and can accommodate special specifications. ・Maximum wafer size 6 inches ・Various dicing frames can be used ・Maximum film width HS-7600: 240mm ・Stage temperature adjustment MAX100℃ ・With dicing tape cutting mechanism ・Adjustable pasting pressure ・Can transfer wafers and chips

  • Product

    Wafer tape mounting device HS-7600 enables uniform attachment without bubbles

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1 Models of Wafer tape mounting device HS-7600 enables uniform attachment without bubbles

Image Part Number Price (excluding tax) Power supply Current capacity Weight Vacuum Size
Wafer tape mounting device HS-7600 enables uniform attachment without bubbles-Part Number-HS-7600

HS-7600

Available upon quote

AC100V, 50/60Hz

3A

25kg

60kPa

700 (D) ×340 (W) ×280 (H) mm

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About Company Handling This Product

Response Rate

100.0%


Response Time

51.6hrs

  • Japan

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