Wafer tape mounting device HS-7600 enables uniform attachment without bubbles
Hugle Electronics Co., Ltd.
About This Product
This is a device that tape mounts wafers. Can be applied evenly without bubbles. (Supports up to 6 inch wafers) It is also possible to transfer wafers and chips.
■Product overview
- Unique structure allows for uniform attachment without creating air bubbles between the wafer and tape.
・Equipped with a special stage to prevent damage to the wafer surface ・Achieved high reproducibility by using built-in rollers that do not require operator skills.
・It is possible to transfer wafers and chips.
・Manufactured to order at our factory in Japan, and can accommodate special specifications.
・Maximum wafer size 6 inches
・Various dicing frames can be used
・Maximum film width HS-7600: 240mm
・Stage temperature adjustment MAX100℃
・With dicing tape cutting mechanism
・Adjustable pasting pressure
・Can transfer wafers and chips
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Product
Wafer tape mounting device HS-7600 enables uniform attachment without bubbles
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Handling Company
Hugle Electronics Co., Ltd.
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Categories
1 Models of Wafer tape mounting device HS-7600 enables uniform attachment without bubbles
| Product Image | Part Number | Price (excluding tax) | Current capacity | Power supply | Size | Vacuum | Weight |
|---|---|---|---|---|---|---|---|
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HS-7600 |
Available upon quote | 3A | AC100V, 50/60Hz | 700 (D) ×340 (W) ×280 (H) mm | 60kPa | 25kg |
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