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  4. Semiconductor assembly related equipment BG tape pasting equipment Model 3250 (Hugle Electronics Co., Ltd.)
Semiconductor assembly related equipment BG tape pasting equipment Model 3250-3250
Semiconductor assembly related equipment BG tape pasting equipment Model 3250-Hugle Electronics Co., Ltd.

Semiconductor assembly related equipment BG tape pasting equipment Model 3250
Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

51.6hours

About This Product

Can handle wafers up to 8 inches. Tape cutting accuracy at the wafer edge is within 127 microns from the edge. In addition, it takes approximately 20 seconds to paste/cut one sheet, contributing to increased work efficiency. Film separator winding/static electricity countermeasures are also available.

■Product overview

・This is a device that attaches BG tape to wafers. Can be applied evenly without bubbles. ・Tape cutting accuracy at the wafer edge is within 127 microns from the edge. - It takes about 20 seconds to paste/cut one sheet, contributing to improved work efficiency. - Tape separator winding/static electricity countermeasures are also possible.

  • Product

    Semiconductor assembly related equipment BG tape pasting equipment Model 3250

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1 Models of Semiconductor assembly related equipment BG tape pasting equipment Model 3250

Image Part Number Price (excluding tax) Height Weight Vacuum Width Depth
Semiconductor assembly related equipment BG tape pasting equipment Model 3250-Part Number-3250

3250

Available upon quote

280mm

45kg

85kPa

432mm

812mm

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About Company Handling This Product

Hugle Electronics Co., Ltd.

Response Rate

100.0%

Response Time

51.6hrs

  • Japan

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