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Semiconductor assembly related equipment BG tape pasting equipment Model 3200-3200
Semiconductor assembly related equipment BG tape pasting equipment Model 3200-Hugle Electronics Co., Ltd.

Semiconductor assembly related equipment BG tape pasting equipment Model 3200
Hugle Electronics Co., Ltd.

Hugle Electronics Co., Ltd.'s Response Status

Response Rate

100.0%

Response Time

51.6hours


About This Product

Can handle wafers up to 8 inches. Tape cutting accuracy at the wafer edge is within 127 microns from the edge. In addition, it takes approximately 20 seconds to paste/cut one sheet, contributing to increased work efficiency. Film separator winding/static electricity countermeasures are also available.

■Product overview

・This is a device that attaches BG tape to wafers. Can be applied evenly without bubbles. ・Tape cutting accuracy at the wafer edge is within 127 microns from the edge. - It takes about 20 seconds to paste/cut one sheet, contributing to improved work efficiency. - Tape separator winding/static electricity countermeasures are also possible.

  • Product

    Semiconductor assembly related equipment BG tape pasting equipment Model 3200

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1 Models of Semiconductor assembly related equipment BG tape pasting equipment Model 3200

Image Part Number Price (excluding tax) Height Weight Vacuum Width Depth
Semiconductor assembly related equipment BG tape pasting equipment Model 3200-Part Number-3200

3200

Available upon quote

280mm

36kg

85kPa

381mm

711mm

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About Company Handling This Product

Response Rate

100.0%


Response Time

51.6hrs

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