Semiconductor assembly related equipment BG tape pasting equipment Model 3200
Hugle Electronics Co., Ltd.
About This Product
Can handle wafers up to 8 inches. Tape cutting accuracy at the wafer edge is within 127 microns from the edge. In addition, it takes approximately 20 seconds to paste/cut one sheet, contributing to increased work efficiency. Film separator winding/static electricity countermeasures are also available.
■Product overview
・This is a device that attaches BG tape to wafers. Can be applied evenly without bubbles.
・Tape cutting accuracy at the wafer edge is within 127 microns from the edge.
- It takes about 20 seconds to paste/cut one sheet, contributing to improved work efficiency.
- Tape separator winding/static electricity countermeasures are also possible.
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Product
Semiconductor assembly related equipment BG tape pasting equipment Model 3200
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Handling Company
Hugle Electronics Co., Ltd.
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Categories
1 Models of Semiconductor assembly related equipment BG tape pasting equipment Model 3200
| Product Image | Part Number | Price (excluding tax) | Depth | Height | Vacuum | Weight | Width |
|---|---|---|---|---|---|---|---|
|
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3200 |
Available upon quote | 711mm | 280mm | 85kPa | 36kg | 381mm |
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