Flexible board (high-definition FPC)-Flexible board (high-definition FPC)

Flexible board (high-definition FPC)
Sanyo Co., Ltd.

About This Product

When it comes to flexible circuit boards (high-definition FPCs), leave it to Sanyo Co., Ltd., a specialized manufacturer. We have built a unique production system that consistently performs the manufacturing process, including flexible substrates with a pitch of 20μm. With our 40 years of experience and track record in flexible circuit boards, we have been able to solve all sorts of problems, not only in terms of cost, but also from prototype board manufacturing to mass production, and can produce high-definition FPC prototypes in a short lead time.

Single-sided, double-sided, and multi-layer options available.We can accommodate all customer needs.

■Narrow-pitch high-definition and ultra-high-definition substrates are custom-made.A semi-conductive method that uses a subtractive method to selectively remove unnecessary portions of conductive foil to form a conductive pattern, electroless metal deposition, and electrolytic plating and etching to form an electrically isolated conductive pattern. This can be handled using additive methods. 20μ pitch on one side, staggered narrow pitch, narrow pitch BGA on one side, sensor coil, flying lead.

■Minute hole processing and BVH connection using chemical etchingChemical etching allows holes to be drilled in several locations at once using chemicals, allowing for lower costs and greater flexibility in hole shapes than laser. It also allows non-through blind via hole (BVH) connections for high-density wiring.

■Introducing polyamide micro-hole processing technology that simultaneously drills holes.Fine processing from 5μm is possible with fine polyimide etching. Microporous filters such as analytical filters and medical filters are available.

Model
There is 1 model available for this product.

Product
Flexible board (high-definition FPC)

Handling Company
Sanyo Co., Ltd.

Categories

Boards & Circuit Boards

FPCs

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1 Models of Flexible board (high-definition FPC)

Image	Part Number	Price (excluding tax)	Surface treatment	Application example	Minimum finished hole diameter	Minimum pitch	Number of layers	Substrate material
	Flexible board (high-definition FPC)	Available upon quote	Electrolytic gold plating 0.03~1.0μm, Electrolytic gold plating (nickel base) 0.3~0.5μm, Electroless gold plating (nickel base) Max0.2μm	For semiconductor inspection, test equipment, liquid crystal panel inspection equipment, etc.	Top diameter Φ50μm (bottom diameter Φ20μm), land diameter (bottom diameter + about 90μm)	20μm on one side, 50μm on both sides	Single-sided, double-sided, multilayer	Polyimide, liquid crystal polymer

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About Company Handling This Product

Sanyo Co., Ltd.

Japan

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Flexible board (high-definition FPC) Sanyo Co., Ltd.

About This Product

■Narrow-pitch high-definition and ultra-high-definition substrates are custom-made.

■Minute hole processing and BVH connection using chemical etching

■Introducing polyamide micro-hole processing technology that simultaneously drills holes.

1 Models of Flexible board (high-definition FPC)