This product is registered by Nikka Seiko Co., Ltd..
About This Product
A peeling agent that swells and peels off epoxy resins that are difficult to peel. Compared to conventional stripping agents, it is less toxic and has a higher flash point, so it can be used heated.
A primer-curing acrylic adhesive developed for slicing semiconductor ingots. Because it is an anaerobic curing type that does not require measuring or stirring and mixing, which is essential for epoxy, there is no waste due to adhesive extrusion, and the adhesive strength is as strong as epoxy, and it is easy to work with, such as fast curing and easy hot water peeling. The improvement can be measured. We also have UV-curable adhesives for temporary fixing that can be removed and dissolved with warm water or solvent.
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