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Semiconductor encapsulation mold parts High precision pot-Pot
Semiconductor encapsulation mold parts High precision pot-CHAMPION CORPORATION Co., Ltd.

Semiconductor encapsulation mold parts High precision pot
CHAMPION CORPORATION Co., Ltd.


About This Product

The inner diameter has a mirror finish.

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    Semiconductor encapsulation mold parts High precision pot

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1 Models of Semiconductor encapsulation mold parts High precision pot

Image Part Number Price (excluding tax) Carbide material Accuracy Material Quantity Inner surface roughness Size
Semiconductor encapsulation mold parts High precision pot-Part Number-Pot

Pot

Available upon quote

Ultrafine particle carbide

0.005

Carbide

1

Rz0.1

Φ23×72.5

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