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  4. Bonding wire for semiconductors Au alloy wire (Au purity ≧99%) G series (Nippon Steel Chemical & Materials Co., Ltd.)
Bonding wire for semiconductors Au alloy wire (Au purity ≧99%) G series-Bonding wire G
Bonding wire for semiconductors Au alloy wire (Au purity ≧99%) G series-Nippon Steel Chemical & Materials Co., Ltd.

Bonding wire for semiconductors Au alloy wire (Au purity ≧99%) G series
Nippon Steel Chemical & Materials Co., Ltd.

About This Product

Nippon Steel Micrometal Co., Ltd. provides high-performance bonding wires for semiconductor packaging by making full use of its know-how in controlling material properties using trace additive elements and controlling crystal grains in metal structures during manufacturing processes, which it has cultivated through the development of steel materials. Masu. Since the invention of transistors, gold wire has been used as the mainstream connection material, but by coating copper wire with palladium, we overcame the oxidation problem and succeeded in commercializing it as the world's first EX series in 2009. It has now become the de facto standard. This wire has excellent long-term bonding reliability and can be bonded with the parameters of 4N wire. gold bonding wire

■About the product

We have a lineup of gold wires that can challenge the limits of bonding technology, such as thinner wires, longer spans, and finer pitches.

■G series

・Au alloy wire (Au purity ≧99%) ・A wire with excellent long-term bonding reliability that can be bonded with the parameters of 4N wire.

  • Product

    Bonding wire for semiconductors Au alloy wire (Au purity ≧99%) G series

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1 Models of Bonding wire for semiconductors Au alloy wire (Au purity ≧99%) G series

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Bonding wire for semiconductors Au alloy wire (Au purity ≧99%) G series-Part Number-Bonding wire G

Bonding wire G

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Nippon Steel Chemical & Materials Co., Ltd.

  • Japan

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